Process Engineer, Principal Roles and Responsibilities: - Developing Backend Assembly Process and/or Package Developments for RF Power products
- Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection
- Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.
- Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving
- Design new customized tooling to adopt off the shelf equipment for our high-volume production.
- Perform verification and qualification activities for new tooling, machine and materials in development projects
- Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.
- Creation, regular review and updating of design & equipment process FMEA
- Technical support on Manufacturing with troubleshooting and providing technical solution
- Participate in new product introduction with material selection, process developments, and data review, as technical expert
- Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis
- Coordinate and support initial mechanical reliability test with failure analysis for root cause finding
Job Qualifications: - BS. MS preferably in mechanical, material, industrial Engineering, Material Engineering, Applied Science, or other relevant qualification
- Minimum 8+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach.
- Must be able to utilize die bond equipment such as Datacon EVO.
- Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages
- Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.
- Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members
- Solid experience and technical understanding in semiconductor reliability standards and test methods
- Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
- Experience in low, medium and high-volume manufacturing for high RF Power Products is preferred
RSU Eligible This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOM's discretion, subject to individual and company performance.
Salary Range The Salary Range for this position is $117,000 - $171,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates' experience, education, and specific knowledge, skills, and abilities.
Benefits: This position offers a comprehensive benefits package including but not limited to:
- Health, dental, and vision insurance.
- Employer-sponsored 401(k) plan.
- Paid time off.
- Professional development opportunities.
