About the role- We are seeking an experienced process lead engineer in the field of optical device packaging and assembly with a degree in Mechanical Engineering, Physics or a related field.
What you'll do- Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and drive Cp, Cpk improvement.
- Support the device packaging RnD and NPI with mechanical design, drawing and thermal modelling.
- Support device testing automation and data analysis automation/scripts or software development and implementation.
- Work with RnD to understand the device specs, particularly mechanical control outline, and assembly requirements and negotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs.
- Work with OSATs to support NPI and volume production contract manufacture with technical SOW drafting.
- Act as the technical project manager for owned projects.
- Provide DFM, DFR, and DFT inputs for HQ RnD teams for device packaging and assembly.
- Keep proper documentation, and initiate ECN and PCN when needed.
- Develop and track packaging and assembly component specifications as well as inventory.
- Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
- Write technical reports and present results to internal and external stakeholders.
- Build and grow the Operation Process Team worldwide.
Required Qualifications- Have a mechanical engineer degree with relevant experience on optical module and/or Lider assembly.
- Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience.
- Experience or knowledge of optical sensors. optical device packaging process, or optical module assembly process.
- Experience with assembly process integration for process flow design and continue process improvement.
- Expertise mechanical drawings using SolidWork, mechanical simulation, and thermal simulation.
- Project management capability/experience is a must.
- Experience working with foundries, OSATs, assembly houses, PCBA fab, and contract manufacturers in process development and yield improvement is important.
- The ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.
- A fast learner is a must.
- Good work ethics is a must
- Capable of keeping company confidential information and IP is a must.
Preferred Qualifications- Knowledge or work experience with PCBA is highly desirable.
- Former experience of microelectronic and optical devices packaging is desired.
- Understanding Silicon Photonics is a plus.
- Experience with FMEA, failure analysis, and 8D report is highly desired.
- Supplier quality management experience is a plus.
- Knowledge of Lidar and relevant technologies is a plus.
- Former experience of writing technical SoW is a plus.
- Familiar with ECN, PCN, and documentation is highly desirable.
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
The pay range for this role is:
150,000 - 300,000 USD per year (Bay Area, CA)
