Job Details:Job Description:We are looking for a talented and driven Packaging Module Development Engineer to join our APTM team at Intel's world-class manufacturing campus in Chandler, Arizona. In this role, you will be a key contributor to the development, optimization, and qualification of advanced semiconductor packaging processes - work that directly enables Intel's products to reach billions of people around the world.
Whether you're a recent PhD graduate eager to apply your research expertise or an experienced engineer ready to take on new challenges, this is an opportunity to do meaningful, high-impact work alongside some of the best engineers in the semiconductor industry.
Key Responsibilities:- Develop and optimize packaging assembly processes and equipment to meet stringent quality, reliability, yield, and cost targets in high-volume manufacturing environments.
- Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE) to characterize processes and drive continuous improvement.
- Innovate new techniques, materials, and tools to address emerging challenges in semiconductor packaging performance and reliability.
- Collaborate with cross-functional teams across engineering, manufacturing, and product development to identify technical risks and ensure successful product launches.
- Establish specifications for materials and equipment, ensuring adherence to Intel's quality and operational standards.
- Document and communicate technical findings, process improvements, and experimental results through reports, white papers, and qualification documents.
- Lead standardization efforts for manufacturing systems, equipment setups, and process flows across Intel's global sites.
As a Successful Candidate, You Will Bring:- Intellectual curiosity - a genuine passion for understanding how things work and a drive to continuously learn and improve.
- Collaborative spirit - the willingness to work effectively with diverse, cross-functional teams and build strong working relationships.
- Resilience and adaptability - comfort navigating ambiguity and the skills to pivot quickly when challenges arise.
- Clear communication - the skills to translate complex technical findings into clear, actionable insights for a variety of audiences.
- Ownership mindset - a proactive approach to taking responsibility for outcomes and driving projects to completion.
- Creative problem-solving - the skills to think outside the box and develop innovative solutions to complex engineering challenges.
Are you ready to take the next step in your career and be part of a team that is shaping the future of technology? Apply today and join Intel's Oregon team, where your expertise and passion will directly influence the world's most advanced semiconductor manufacturing processes.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:- Master's and 3+ years in relevant experience, or PhD in Mechanical Engineering, Physics, Chemistry, or a related STEM field with 1+ years of experience.
- Relevant experience will be the following:
- Process development and equipment qualification in a manufacturing setting.
Preferred Qualifications:- 3+ years of experience in:
- Data analysis and risk assessment methodologies.
- Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
- Semiconductor fabrication processes, assembly methodologies, and packaging flows (e.g., flip chip, fan-out, 2.5D/3D integration).
- Programming languages such as Python, MATLAB, or SQL for complex data analysis.
- Quality systems, documentation standards, and packaging reliability evaluation tools.
Job Type:College Grad
Shift:Shift 1 (United States of America)
Primary Location:US, Arizona, Phoenix
Additional Locations:BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
