Current Your Role:In this role you will be instrumental in developing our High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy and program development. By connecting across key business unit partners and leveraging EMD Electronics core competencies, the candidate will drive business and product development from idea to proof of concept for transfer to high volume manufacturing.
The ideal candidate will combine a deep equipment, process and integration knowledge of High Performance Packaging technologies (including Wafer Level Packaging, Hybrid Bonding, Fusion bonding and adjacent technologies) with a vast ecosystem network (both equipment suppliers and IDM/Foundry/Memory customers).
The perferred location for this role is Tempe, AZ. Other US locations may be considered.
Responsibilities:- Through technical expertise, identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps
- Through industry/ecosystem connections continue to acquire in-depth strategic knowledge of customer and OEM roadmaps
- Transfer knowledge/educate peers (both laterally and up) on High Performance Packaging (Advanced Packaging) roadmaps
- Leverage industry knowledge to identify process/equipment/integration challenges
- Work across BU's and CTO office to identify material solutions/developments to solve industry challenges
- Leverage industry network and connections to engage the ecosystem on collaborative development opportunities
- Leverage deep technical knowledge to ensure development programs are identifying and meeting industry standard datasets
- Ensure development programs are leveraging industry expertise to deliver relevant datasets in the timeliest manner
Who You AreMinimum Qualifications:- MSc or higher (Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields)
- 10+ Years 300mm Process/ Equipment R&D hands on experience
- Advanced Packaging (300mm) Equipment Tool owner
- Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development
- Developing integration and process flows
- 7+ years of collaborative external business developments
- SOW (Scope of Work)/ POC (Proof of Concept)/DOE's on equip/material definition
Preferred Qualifications:- 5+ years experience of Adv Pkg Consortia engagements (IMEC, Fraunhofer, CEA Leti, etc) including engagement model definition/ SOW development/ POC execution
- Demonstrated ability to work in highly ambiguous environments
- Demonstrated ability to work across matrixed organizations and deliver results
- Demonstrated ability to influence up to garner resources
- Entrepreneurial mindset
- Ability to condense complicated material down to key actionable items
- Ability to enroll resources to deliver success
- Demonstrated knowledge of customer/supplier interactions and how best to 'mine' the 'why's & how's' from those conversations
- Self-starter, ability to operate with little direction
Pay Range for this position: $178,600 - $287,900
The offer range represents the anticipated low and high end of the base pay compensation for this position. The actual compensation offered will be determined by factors such as location, level of experience, education, skills, and other job-related factors. Position may be eligible for sales or performance-based bonuses. Benefits offered by the Company include health insurance, paid time off (PTO), retirement contributions, and other perquisites. For more information click
here.
