Role Overview:We are seeking a highly motivated engineer to lead multi-physics modeling and simulation for next-generation advanced packaging systems. This role focuses on the co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels to enable high-performance AI/HPC advanced packaging solutions.
The candidate will collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical and thermal performance, and system scalability for advanced heterogeneous integration platforms.
In this role you will:- Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.
- Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability.
- Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures.
- Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures.
- Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability.
You might thrive in this role if you have:- Enjoy solving extremely challenging thermal, mechanical and electrical challenges for some of the most advanced AI/HPC packaging technology.
- Are motivated by pushing the limits of heterogeneous integration, high-power delivery, advanced cooling, and large-scale packaging architectures.
- Like developing new modeling methodologies and engineering solutions rather than relying only on conventional industry approaches.
- Want to influence real product architecture decisions through simulation-driven insights across chip, package, cooling, and system design.
- Enjoy learning broadly across semiconductor technologies, including chip architecture, power delivery, package integration, materials, cooling, and system-level interactions.
- Strong experience in thermal and mechanical modeling for advanced packaging systems.
- Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.
- Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches.
- Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent.
- Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions.
Preferred Qualifications:- Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications.
- Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
- Strong communication, cross-functional collaboration, and technical leadership skills
To comply with U.S. export control laws and regulations, candidates for this role may need to meet certain legal status requirements as provided in those laws and regulations.
