Your Team, Your ImpactThe Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer's most challenging designs and integrations with industry-leading packaging technologies.
What You Can ExpectThis engineer will be responsible for leading small project teams of design and simulation engineers to deliver innovative high quality packaging solutions. The engineer will also interface with package suppliers to select package technology to ensure manufacturability, and compliance with performance, reliability, and cost requirements.
What We're Looking For- Experience in substrate and/or board design for package technologies with basic understanding of design for manufacturing and reliability as well as electrical performance and the ability to make trade off decisions accordingly
- Proven ability to lead complex projects involving cross-functional stakeholders
- Basic usage of tools and workflows in Cadence Allegro (3DIC/ISP/APD/SiP)
- Bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience; Master's or PhD degree with IC / Packaging focus preferred
Skills needed to be successful in this role:- Innovative thinking, fundamental understanding of design rules, breakout, place and route, signal shielding, reference plane, power distribution, pinout considering overall package and system requirements.
- Experience with current generation HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIE, Ethernet, etc
- Good understanding of signal and power integrity at substrates, board, package, and system level.
- Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
- Familiarity in tools and workflows: Cadence Sigrity/Clarity/Innovus/Virtuoso, Ansys, AutoCAD, SolidWorks
- Experience contributing to tool, process, and flow development, library maintenance
- Experience interacting with chip design and electrical simulation teams to optimize the design. Familiarity with running and interpreting signal and power simulations is a plus
- Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.
- Strong communication, presentation and documentation skills
Expected Base Pay Range (USD)121,000 - 179,040, $ per annum
The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life's most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.
Interview Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.#LI-MM1
