Champion the development of electroplating processes for advanced packaging technologies, focusing on integration and yield improvements. Collaborate with teams and customers to innovate and enhance plating recipes and workflows in manufacturing environments.

Take ownership of developing and maintaining software applications, migrating legacy systems, and optimizing processes in a collaborative, fast-paced environment. Provide after-hours support and create detailed technical documents to enhance operational efficiency.

Champion the development of innovative software solutions in the ZNT PAC environment, collaborating closely with teams to enhance factory efficiency and automate semiconductor processes while ensuring high-quality standards and timely support.

Champion the advancement of packaging processes through innovative lithography, integration, and yield improvement strategies in a collaborative environment focused on MEMS and photonic developments, ensuring top performance and communication with stakeholders.

Join a team that empowers semiconductor innovation through expert failure analysis. Provide critical support by conducting SEM, FIB, and TEM evaluations, ensuring high-quality results that drive operational excellence and process improvements.