Join a team that's shaping the future of advanced semiconductor technology by defining and executing physical verification flows for next-gen HBM logic die and SoCs, ensuring quality and reliability from design through to production.

Drive technical innovation and collaboration in advanced semiconductor packaging solutions, influencing industry-leading strategies and delivering high-value results that enhance competitive edge and align with organizational goals.

Drive excellence in SSD system validation by independently managing end-to-end processes, analyzing results, and applying advanced technical expertise to enhance customer-centric solutions. Collaborate across teams to optimize validation practices.

Elevate process efficiency in die bonding through innovation and optimization. Drive product quality and yield improvements while addressing manufacturing challenges and collaborating with suppliers for cost-effective solutions.

Take ownership of innovative process development in semiconductor packaging, focusing on yield, quality, and reliability improvements. Collaborate with cross-functional teams to resolve manufacturing issues and drive efficiency in advanced technology.