Lead HBM SoC RTL design and integration, driving technical strategy and cross-team execution for next-gen logic die with a focus on high-quality RTL implementations and best practices to enhance development efficiency across HBM programs.

Lead and innovate the design and integration of HBM SoC logic die while overseeing multi-team collaboration, implementing best practices, and driving product strategy for next-gen semiconductor technologies.

Drive process improvements by planning and executing manufacturing operations, ensuring quality outputs, and collaborating on potential solutions for product matching and efficiency enhancements throughout the product lifecycle.

Empower innovation by sourcing and assessing venture investments and driving AI initiatives. Collaborate with teams to shape strategy and executive recommendations while mentoring others in a dynamic environment.

Create robust power delivery networks for high-performance HBM products. Collaborate across teams to ensure efficient design, optimize performance, and drive reliability. This hands-on role emphasizes EM/IR analysis and cross-domain optimization.