Micron Technology

Director, HBM RTL Design and Integration

Micron Technology$177K — $348K *
Consumer Technology
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes (e.g., TSMC).
  • Deep expertise in RTL design, SoC integration, and full RTL-to-GDS flows, with a focus on synthesis and timing.
  • Strong experience integrating complex IP subsystems such as controllers, NOC, and PHY-adjacent logic.
  • Familiarity with EDA tools and scripting languages including SystemVerilog, Python, and TCL.
  • Knowledge of DRAM/HBM systems and JEDEC standards preferred.

Responsibilities

  • Lead SoC RTL design and integration for HBM logic die, focusing on subsystem partitioning and IP integration.
  • Drive the translation of architectural specifications into high-quality RTL implementations across teams.
  • Oversee the integration aspects of SoCs, ensuring clocking, reset, and power intent are managed correctly.
  • Establish design methodologies to enhance quality, reuse, and efficiency in HBM programs.
  • Collaborate with various teams to ensure successful end-to-end product execution.
  • Coordinate with Product Engineering and Manufacturing to deliver manufacturable HBM solutions.
  • Lead and scale a high-performing RTL design team, emphasizing recruiting and team retention.

Benefits

  • Choice of medical, dental, and vision plans to suit family healthcare needs.
  • Income protection programs for illness or injury-related work absence.
  • Paid family leave for personal and family health matters.
  • Robust paid time-off program along with paid holidays to promote work-life balance.
Full Job Description
As a Director of HBM RTL Design and Integration, you will lead a team responsible for the design, integration, and delivery of next-generation HBM SoC logic die, with a strong focus on RTL development and IP integration. You will drive technical strategy and execution across multiple product generations, working closely with architecture, verification, physical design, firmware, and product engineering teams. Key Responsibilities • Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning, IP integration, and SoC-level design convergence. • Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams. • Oversee SoC integration aspects, including clocking, reset, power intent, configuration infrastructure, and system-level design correctness. • Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs. • Partner with SoC Architecture, Verification, Physical Design, Firmware, and System teams to ensure successful end-to-end product execution. • Work closely with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure robust, manufacturable HBM solutions. • Drive trade-offs among performance, power, area, schedule, and risk to ensure optimal product outcomes. • Build, lead, and scale a high-performing RTL design and integration team, including recruiting, mentoring, and retention of top engineering talent. Qualifications • Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes (e.g., TSMC). • Deep expertise in RTL design, SoC integration, and full RTL-to-GDS flows, including synthesis, timing, and signoff considerations. • Strong experience integrating complex IP subsystems (controllers, NOC, microcontrollers, PHY-adjacent logic, RAS, MBIST, interfaces). • Familiarity with EDA tools and scripting languages (e.g., SystemVerilog, Python, TCL). • Knowledge of DRAM/HBM systems and JEDEC standards preferred. Preferred Qualifications • 15+ years of relevant SoC design experience with increasing scope and technical leadership. • Demonstrated success driving multiple tape-outs and cross-functional SoC programs. • Strong leadership, communication, and organizational influence skills. • Experience building and managing global engineering teams. The US base salary range that Micron Technology estimates it could pay for this full-time position is: $177,000.00 - $348,000.00 a year Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

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Learn more about Micron Technology
Size
43,000 employees
Market Cap
$53.7 billion
Industry
Net Income
$2.9 billion
Founded
1978
5 Year Trend
+8.6%
Revenue
$22 billion
NASDAQ

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