Transform cutting-edge semiconductor packaging by leading design and development of high-speed IC solutions, ensuring optimal performance and manufacturability through collaboration across engineering teams and innovative technologies.

Advance security and compliance by assessing AI technologies for risks, aligning with regulations, and collaborating cross-functionally to protect data and intellectual property in a rapidly evolving landscape.

Elevate your career by managing and advancing our Enterprise Risk Management program. Collaborate with cross-functional teams to integrate cybersecurity risks, lead executive reporting, and drive strategic risk initiatives across the organization.

Advance innovative packaging technologies for cutting-edge silicon photonics and CPO. Lead process development and collaborate with partners to solve complex challenges, ensuring reliable assembly methods in a fast-paced environment.

Champion IP development and delivery for advanced SoC products, leading cross-functional teams from conception through Mass Production Release, ensuring successful outcomes and effective communication with stakeholders.