Innovate with us as a Package Design Verification Specialist, driving quality assurance and refining processes for advanced packaging solutions. Collaborate with cross-functional teams to enhance workflows and accelerate product delivery effectively.

Engineer next-gen physical design methodologies for high-performance processor chips, collaborating with global teams. Lead innovations in RTL-to-GDSII flows while mentoring engineers, driving design excellence across multiple projects.

Collaborate with cross-functional teams to drive physical design projects, improving methodologies and integration processes for next-gen high-performance chips in an innovative environment, focusing on server, 5G/6G, and networking applications.