Join a team that drives innovation in 2.5D/3D advanced packaging reliability, collaborating with external partners and internal teams to ensure robust, cutting-edge semiconductor solutions through expert analysis and problem-solving in a fast-paced environment.

Champion innovative SoC designs, leading architecture and development while collaborating with cross-functional teams to drive the CXL product roadmap and enhance data center solutions.

Engage with cross-functional teams to validate high-speed networking technologies, drive parameter tuning, and ensure product quality through extensive data analysis and firmware interaction.

Lead the charge in end-to-end execution of innovative optical solutions, managing cross-functional teams and driving program delivery for advanced semiconductor technologies that support next-gen cloud and AI infrastructure.

Drive the verification of advanced semiconductor solutions, ensuring compliance with performance standards. Lead cross-functional teams in scalable UVM environments to deliver critical designs for high-performance computing and networking.