Optimize die-to-wafer hybrid bonding processes and equipment, enhancing yield, reliability, and efficiency while leading innovative platforms in semiconductor manufacturing for technology advancements.

Join us to validate cutting-edge CPU technologies, driving high-quality outcomes in our post silicon validation efforts. Collaborate with a skilled team to ensure operational excellence while enhancing your technical expertise in a dynamic environment.

Shape the future of semiconductor manufacturing by leading process innovation in thin film deposition, driving solutions for advanced technology nodes while collaborating cross-functionally and guiding strategic initiatives to optimize production.

Join our team to tackle the complexities of CPU physical design from RTL to GDS, ensuring readiness for manufacturing through verification, analysis, and collaboration across disciplines to enhance design capabilities and efficiencies.

Unlock innovative thermal design and analysis for advanced computing solutions, ensuring performance and compliance across systems. Collaborate cross-functionally to elevate GPU and AI product development through simulation and experimental methodologies.