Transform your career by joining a dynamic design team focused on the architecture and integration of baseband systems for cutting-edge products. Collaborate across functions to drive innovation in wireless technology and product development.

Lead package architecture initiatives, optimizing design configurations and collaborating cross-functionally. Drive innovations in SiP/module development while leveraging AI tools for improved efficiency and performance across advanced silicon technologies.

Unlock potential by driving physical design aspects in complex digital logic projects. Collaborate with cross-functional teams to optimize placement, timing, and power integrity, ensuring high-performance outcomes and innovative methodologies.

Drive innovation in CPU-based subsystems for high-performance, low-power wireless SoCs. Collaborate with architects and engineers to meet power, performance, and area goals, playing a key role in ASIC design for cutting-edge products.

Transform complex chip design challenges into innovative solutions by leveraging your expertise in electrical verification, scripting, and CAD tools. Collaborate with cross-functional teams to optimize power grid methodologies and enhance design efficiency.