Wet Etch Process Engineer

II-VI Aerospace & Defense

$100K — $130K *
Manufacturing & Automotive
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's, Master's, or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
  • 10+ years in semiconductor wet etch process development for GaAs and InP-based optoelectronic devices.
  • Strong knowledge of wet etch chemistry, selectivity optimization, and surface roughness control.
  • Hands-on experience with SEM, AFM, and other metrology tools for process verification and defect analysis.
  • Deep understanding of VCSELs, photodiodes, and EMLs etching challenges and performance implications.
  • Proficient in SPC, DOE, and data-driven optimization techniques.
  • Ability to collaborate in cleanroom environments with cross-functional teams.

Responsibilities

  • Develop and optimize wet etch processes for optoelectronic devices.
  • Define and control etch chemistry and parameters to meet device performance criteria.
  • Utilize advanced metrology tools for characterization and defect analysis.
  • Troubleshoot etch process deviations and implement corrective actions.
  • Collaborate with device engineers to integrate processes into semiconductor fabrication.
  • Establish SPC methodologies for ongoing process improvement.
  • Evaluate new chemistries and etching techniques for enhanced capabilities.
  • Mentor junior engineers and provide technical guidance in process development.

Benefits

  • Opportunity to work on cutting-edge optoelectronic technologies.
  • Access to advanced metrology equipment and techniques.
  • Collaborative environment with cross-functional teams.
  • Mentorship and leadership opportunities for career growth.
  • Involvement in continuous improvement initiatives and specialized training.
Full Job Description
Job Description

Primary Duties & Responsibilities
  • Develop and optimize wet etch processes for VCSELs, photodiodes, and edge-emitting lasers on GaAs and InP substrates.
  • Define and control etch chemistry, etch rate, isotropic vs. anisotropic etching, selectivity, and undercut management to meet stringent device performance criteria.
  • Utilize metrology tools such as AFM, SEM, ellipsometry, profilometry, XPS, XRD, and optical interferometry for process characterization and defect analysis.
  • Troubleshoot etch process deviations, material compatibility issues, and surface roughness effects, implementing corrective actions to ensure high device yield and process stability.
  • Work closely with device engineers and integration teams to integrate wet etch processes into the overall semiconductor fabrication flow.
  • Establish and maintain SPC methodologies for process monitoring and continuous improvement.
  • Evaluate and qualify new wet etch chemistries, process automation techniques, and etch equipment to enhance process capabilities.
  • Develop and document etch process recipes, SOPs, failure analysis reports, and best practices for knowledge sharing and training.
  • Mentor junior engineers and provide technical leadership in wet etch process development for optoelectronic applications.


Education & Experience
  • Bachelor's, Master's, or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
  • 10+ years of hands-on experience in semiconductor wet etch process development, particularly for GaAs and InP-based optoelectronic devices.
  • Strong expertise in wet etch chemistry, selectivity optimization, surface roughness control, and etch stop layers.
  • Hands-on experience with metrology techniques such as SEM, AFM, ellipsometry, profilometry, XPS, and XRD for process verification and defect analysis.
  • Deep understanding of etching challenges for VCSELs, photodiodes, and EMLs, including precise mesa formation, sidewall passivation, and optical performance impact.
  • Proficiency in SPC, DOE, and data-driven process optimization.
  • Ability to work in a cleanroom environment and collaborate with cross-functional teams, including device engineers, production teams, and R&D groups.

Skills
  • Experience in high-volume semiconductor manufacturing or advanced R&D prototyping for optoelectronic devices.
  • Familiarity with chemical safety, fume hood operations, and waste disposal protocols for semiconductor wet etch processing.
  • Familiarity with automation (SECS/GEM), scripting, or AI-driven process control, including FDC and APC.
  • Demonstrated leadership in technical project management, process transfers, and mentoring junior engineers.

Working Conditions
  • Will be exposed to areas where hand tools and power tools are being operated
  • Will be exposed to areas where hazardous chemicals or gases are stored
  • Ability to work in a cleanroom environment per semi-conductor protocol/requirements

Physical Requirements
  • Work in a class 100/1000 clean room for extended periods
  • Wear full cleanroom attire (smock, mask, etc.)
  • Work with and/or around chemicals (such as solids and acids)
  • Stand for up to 4 hours at a time
  • Lift up to 16-30 Pounds
  • Push/Pull up to 16-30 pounds
  • Sit for up to 4 hours at a time

Safety Requirements

All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.

Quality and Environmental Responsibilities

Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.

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