Job Summary:The system engineering department is hiring a thermal mechanical engineer. You will be responsible for performing structural and thermal simulations to optimize the design of electro-optical sub-assemblies. Your work will directly impact on the performance and reliability of our quantum computer sub-systems.
Responsibilities:- Develop detailed FEA/CFD models of components, packages, optical-electronic modules, and system-level assemblies using appropriate simulation tools such as ANSYS, COMSOL, or equivalent platforms.
- Correlate FEA results with experimental measurements, prototype test data, and hardware observations to improve model fidelity and support simulation-driven design decisions.
- Perform warpage and deformation analysis for multi-material assemblies, accounting for mismatch in thermal expansions, nonlinear material behavior, temperature gradients, and boundary conditions.
- Develop thermal cycling and mechanical fatigue models to predict long-term reliability, including creep, stress relaxation, and interface degradation.
- Identify mechanical risk drivers and recommend design, material, or process changes to improve robustness, manufacturability, and yield.
- Analyze failures related to electro-optical assembly design and providing solutions. General design activities such as requirements management, materials and component selection, Design Failure Modes and Effects Analysis (FMEA), and tolerance analyses.
- Develop end-to-end simulation workflows to automate processes, assess performance across diverse operating scenarios, documentation, and tools to improve efficiency, accuracy, and repeatability.
- Document and communicate results through clear technical reports, design reviews, and executive level summaries.
Experience/Qualifications:- M.Sc., or Ph.D in Mechanical Engineering, Electrical Engineering and Physics or related field.
- 5+years of hands-on modeling and simulation experience in the semiconductor industry.
- Strong understanding of thermal conduction and convective heat transfer methodologies.
- Deep knowledge of solid mechanics principles, including stress, strain, fatigue, creep, constitutive models of elastic, visco-plastic, and plastic materials.
- Proficiency with simulation tools such as ANSYS (Mechanical, Icepak and Fluent), COMSOL, or equivalent, including nonlinear and transient analyses.
- Working knowledge of lab-scale validation techniques.
Desired Skills/Experience:- Experience with Ansys AEDT and Ansys Sherlock.
- Understanding advanced semiconductor packaging, solder joints, and reliability modeling techniques.
- Knowledge of common optical system specifications and optical component specifications.
- Exposure to SOC thermal mechanical analysis.
- Exposure to optical structural analysis.
The ranges below reflect the target ranges for a new hire base salary. One is for the Bay Area (within 50 miles of HQ, Palo Alto), the second one (if applicable) is for elsewhere in the US (beyond 50 miles of HQ, Palo Alto). If there is only one range, it is for the specific location of where the position will be located. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.
U.S. Base Pay Range
$100,000-$145,000 USD
Bay Area Pay Range
$140,000-$160,000 USD
