About the role

We're growing the thermal team, so you'll have real scope and a say in how the function is built.

You will own the thermal design that enables our AI accelerators - from the silicon package out to the system-level. You'll take thermal solutions from concept through production: building the models, running the simulations, designing the solution, and then proving it on real hardware. This is a hands-on role with a heavy validation component - you'll spend as much time closing the gap between your model and your measurements as building the model in the first place. You'll work directly with vendors on thermal solution development, and with our packaging, mechanical, and electrical teams on the tradeoffs that decide how much power we can put through a part.
What You'll Do

• Own package-level thermal design and the thermal solution that supports it, from concept through production.

• Own thermal validation and verification - build the test plans, run them, and close the loop between measurement and model.

• Drive hands-on thermal simulations in Ansys Icepak (or equivalent) and 1D flow network modeling (Macroflow or equivalent) for system-level analysis.

• Support system-level thermal design for datacenter applications and engage directly with vendors on thermal solution development.

• Use and develop AI-assisted tool flows to accelerate thermal modeling, data processing, and signoff timelines.

What We're Looking For

• 5+ years of thermal design experience on advanced compute hardware, with demonstrated ownership of a thermal design from concept through production

• Exceptional abilities in thermal design and analysis: strong background in heat transfer and fluid dynamics fundamentals

• Hands-on with Ansys Icepak (or equivalent) for detailed CFD, and with 1D flow network tools (Macroflow or equivalent) for system-level analysis

• Demonstrated ability to work closely with packaging, mechanical, electrical, and vendor partners to converge and validate thermal solutions

• Experience in designing liquid cooled solutions for data center applications

• Experience with TIM selection and characterization

• Ability to distill complex thermal data into actionable recommendations for both technical and non-technical stakeholders

• Hands-on thermal measurement and characterization experience -- thermal test development, instrumentation, and test-to-model correlation. Experience establishing thermal test capability from the ground up is a plus

Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

Full compensation packages are based on candidate experience and relevant certifications.

California pay range

$190,000-$230,000 USD

Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.