Job Details:Job Description:As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes.
Key Responsibilities- Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
- Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC).
- Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces.
- Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods.
- Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones.
- Document technical improvements and innovations through research papers and presentations.
Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
This position is not eligible for Intel immigration sponsorshipKnowledge and/or experience listed below would be obtained through a combination of your school/work and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum Qualifications- Bachelor's degree in mechanical engineering or a related field with 6 months of hands-on experience.
- Experience mentioned above should be in:
- Equipment Engineering, Mechanical Desing and/ or Process Engineering.
Preferred Qualifications- Experience with mechanical design software such as SolidWorks or AutoCAD.
- Portfolio showcasing self-completed projects from concept to fabrication.
- Familiarity with semiconductor packaging processes and technology.
- Strong technical and analytical skills, with a proven ability to deliver results on complex, time-critical projects.
Join us to contribute to groundbreaking technology innovation while growing your career in a dynamic and inclusive environment.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location:US, Arizona, Phoenix
Additional Locations:BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $85,200.00-120,280.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
