Analog Devices is seeking a
Staff Process Engineer as a senior technical contributor responsible for process ownership, process development, and continuous improvement focusing on wafer-level capping of MEMS Devices in Wilmington, Massachusetts. This role provides technical leadership, line sustainability, productivity improvement and cost improvement; while mentoring engineers and technicians in support of continuous operations.
Key Responsibilities:• Act as a technical contributor, driving continuous improvement for existing volume manufacturing processes, layers and tools. Working with Equipment and Manufacturing groups to achieve KPIs.
• As a technical contributor working with key groups/disciplines in determining RCA of yield issues, excursions, and equipment downs and implementing corrective actions and robust solutions to improve the process.
• Working with development groups and other disciplines within Analog Devices in defining and developing new capabilities.
• Establishing clear standards for methods of equipment and/or process works amongst shift personnel and engineering groups.
• Periodic review of KPIs associated with Safety, Quality, Output and ROI on equipment and processes for Capping area and driving associated initiatives.
• Perform and lead root cause analysis (RCA) using structured methodologies (8D, FMEA, 5-Why) and ensure robust corrective actions.
• Ability to analyze large, complex data sets. Routinely review SPC charts and CPK charts to ensure process targeting and robustness.
Minimum Qualifications:• Bachelor's degree in Applied Physics, Electrical Engineering, Materials, or relevant technical discipline.
• 10+ Years experience in engineering related discipline
• Excellent technical problem solving and multi-tasking skills.
• Self-directing, self-motivated and ability to work in a dynamic manufacturing environment.
• Data driven and ability to apply science theory and engineering concepts.
Preferred Skills/Competencies:• Strong written and oral communication skills; ability to clearly communicate across multiple functionalities.
• Experience with wafer level bonding, wafer level grind/polish, wafer level dicing.
• Semiconductor manufacturing environment or related high-volume clean-room manufacturing experience.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $113,190 to $163,905.
- Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
- This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
