The Process Quality Engineering (PQE) team works between Fab4 Technology Development (TD) and Fab4 High-Volume Manufacturing (HVM - ID1) in Boise, ID. PQE manages FOUP Environmental Control (FEC) programs, Process Risk and Control (PRC) for Colocation, and the Fab Contamination Control program. The team collaborates with various engineering groups across Fab4 in Boise, Micron's global Fab network, and Global teams. They focus on understanding challenges related to processes, tools, and systems. They develop innovative solutions to address these issues quickly.
In this role, you will contribute to and manage FOUP Environment Control (FEC) related to Airborne Molecular Contamination (AMC) in DRAM New Product Introduction (NPI). You will aid both HVM enablement and next-node DRAM technology development. This role includes establishing, executing, and refining AMC process classification and management, with emphasis on DRAM Dry Etch and Thin Films deposition processes.
Responsibilities:
- Direct the creation of the environmental control program for FOUP within Fab4 TD and HVM (ID1) greenfield startup, guaranteeing complete system preparedness.
- Partner with Micron's global HVM network to gather well-established approaches and lessons learned for FEC systems, including yield impact studies from current and previous DRAM nodes. Lead the creation and implementation of FEC system Copy Exact/Copy Smart strategies as appropriate.
- Monitor production lines for yield issues that may result from wafer or process-related contamination. Collaborate with Process Integration and Process & Equipment Engineering teams to develop and complete experiments to resolve these issues.
- Partner with vendors to evaluate new hardware and FOUP solutions, while aligning with internal collaborators to define and drive the roadmap for Fab4 HVM FOUP strategy.
- Represent the Fab4 PQE team in global alignment meetings with Micron's fab network and central teams to ensure consistency and adoption of validated methods.
Minimum Qualifications:
- Master's degree or higher in Engineering (Materials Science, Chemical, Mechanical, or a related field)
- More than 5 years working within semiconductor manufacturing in Process Module Development or Process Integration.
- Outstanding knowledge of DRAM or Logic process areas, including Dry Etch, Thin Film Deposition, Photolithography, Wet Clean, CMP, and Metrology with a broad understanding of equipment used across these domains.
- Strong understanding of wafer and process-related contamination mechanisms across various process areas, and their impact on yield and product quality.
- Extensive experience in Statistical Process Control (SPC), including real-time fab process data reporting, setup, review, and analysis, with actionable recommendations for improvement. Proficient in JMP for advanced data visualization and analytics.
Preferred Qualifications:
- PhD in Materials Science, Chemical Engineering, Chemistry, or a related science/engineering field with more than 7 years demonstrated experience in Semiconductor TD or HVM.
- Semiconductor TD/HVM background in FOUP Environment Control to boost process quality and increase wafer yield.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
