IonQ

Staff Process Engineer, Packaging

IonQ$145K — $209K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in engineering or physical sciences.
  • 1-2 years of experience operating complex automated equipment in a production environment.
  • Demonstrated ability to diagnose equipment problems and implement fixes.
  • Strong preference for hands-on work with physical hardware.
  • Ability to effectively communicate and train operators.
  • Willingness to work onsite in College Park five days a week during training and initial ramp-up.

Responsibilities

  • Provide real-time sustaining engineering support in the cleanroom.
  • Operate, program, troubleshoot, and enhance complex packaging equipment.
  • Create and maintain equipment recipes and process programs based on data analysis.
  • Investigate faults, identify root causes, and implement corrective actions.
  • Train operators on equipment and processes, creating clear work instructions.
  • Improve packaging processes related to yield, throughput, and capabilities.
  • Support hands-on prototype builds from preparation to inspection.

Benefits

  • Comprehensive medical, dental, and vision plans.
  • Matching 401(k).
  • Unlimited PTO and paid holidays.
  • Parental/adoption leave.
  • Legal insurance.
  • Home technology stipend.
Full Job Description
Location: This role is based onsite at our headquarters in College Park, MD.
Travel: Minimal (Job ID: 1770

The Role:

We are looking for a hands-on Process Engineer, Packaging to keep our College Park cleanroom production moving. You will spend approximately 70-80% of your time in the cleanroom operating, programming, troubleshooting, and improving the equipment used to build our quantum processing units (QPUs).

This is a floor-first engineering role. You will work directly with technicians and engineers to solve problems at the equipment, create and release robust recipes, train operators, and stand up new capabilities. Specific microelectronics packaging experience is valuable, but it is not the only path to success. We can teach our processes; we are looking for an experienced engineer who is driven to learn, takes pride in careful hands-on work, and does what the team needs to deliver hardware.

The role may be leveled as Process Engineer or Senior Process Engineer based on demonstrated experience and scope.

Responsibilities:
  • Provide real-time sustaining engineering support in the cleanroom so QPU builds, technician work, and critical equipment stay on track.
  • Personally operate, program, troubleshoot, and improve complex packaging equipment, with particular emphasis on wire bonding and die/flip-chip bonding.
  • Create, validate, release, and maintain equipment recipes and process programs; use data and disciplined experimentation to establish stable operating windows.
  • Investigate equipment faults, process excursions, and product failures; identify root causes, implement corrective actions, and verify that the fix is effective.
  • Train and qualify operators on packaging equipment and processes, and translate practical learning into clear work instructions, travelers, and operating guidance.
  • Improve existing packaging processes with respect to yield, throughput, repeatability, uptime, and capability.
  • Support hands-on prototype and new-product builds from component preparation through assembly, inspection, characterization, and release.
  • Handle fragile, high-value components carefully and model excellent cleanroom discipline during every build.
  • Collaborate across packaging, manufacturing, QPU design, fabrication, quality, test, and external suppliers to remove blockers and deliver hardware.

Requirements:
  • A bachelor's degree in an engineering or physical sciences discipline.
  • 1-2 years professional experience beyond coursework and internships personally operating complex automated equipment in a production, development, or laboratory environment.
  • Evidence that you have personally diagnosed equipment or process problems, implemented fixes, and verified results.
  • A genuine preference for working at the equipment and with physical hardware for most of the day.
  • The ability to learn unfamiliar equipment and processes quickly while working safely and carefully.
  • Clear communication skills and the ability to train operators with different levels of technical experience.
  • The ability to work onsite in College Park five days per week during training and initial ramp-up. Some flexibility for limited remote work can be afforded once training is complete.
  • The ability to work for extended periods in full cleanroom gowning.

Preferred Qualifications:
  • Hands-on experience programming or troubleshooting wire bonders , die bonders, and/or optical packaging equipment.
  • Experience in microelectronics, optoelectronics, photonics, RF/microwave hardware, MEMS, aerospace electronics, medical devices, or another precision hardware field.
  • Experience with packaging processes such as solder reflow, epoxy dispense, plasma cleaning, optical inspection, profilometry/interferometry, electrical test, or UHV-compatible assembly.
  • Experience selecting equipment, working directly with vendors, installing and qualifying tools, and releasing recipes for production use.
  • Experience training and qualifying operators and improving a process under schedule pressure.
  • Strong internal drive: you identify the next useful action, follow through without constant prompting, and close the loop.
  • Low ego: no task is beneath you when it helps the team deliver; you are equally willing to troubleshoot a recipe, prepare parts, or clean a tool.
  • Careful and deliberate execution: you slow down when the hardware demands it, protect fragile parts, and treat repeatability and contamination control as part of the engineering work.
  • Team-first behavior: you share knowledge, respond to technician needs, communicate problems early, and optimize for the success of the build rather than personal ownership of the solution.

What success looks like
  • First 30 days: learn the cleanroom workflow and independently operate several core tools while contributing to live builds.
  • By 60 days: own at least one process or equipment family and resolve routine floor escalations with appropriate support.
  • By three months: serve as a credible sustaining-engineering resource across most of the packaging workflow, including troubleshooting and recipe or program changes.
  • By 6 months: deliver measurable improvements in equipment uptime, yield, throughput, or process capability while training and enabling others.

The total compensation package includes base, bonus, equity, and a range of benefit options found on our career site.

If this role has a commission structure, the compensation range below just reflects the base compensation range.

Wage Transparency:

$145,920-$209,241 USD

Compensation will vary based on individual factors such as education, qualifications, and experience of the final candidate(s), specific office location, and calibration against relevant market data and internal team equity. Posted base salary figures are subject to change as new market data becomes available. Our benefits include comprehensive medical, dental, and vision plans, matching 401(k), unlimited PTO and paid holidays, parental/adoption leave, legal insurance, and a home technology stipend. Details of participation in these benefit plans will be provided when a candidate receives an offer of employment.

At IonQ, we believe in fair treatment, access, opportunity, and advancement for all while striving to identify and eliminate barriers. We empower employees to thrive by fostering a culture of autonomy, productivity, and respect. We are dedicated to creating an environment where individuals can feel welcomed, respected, supported, and valued.

About IonQ

IonQ is a quantum computing company that is developing a general-purpose, full-stack quantum computer based on trapped ion technology. The company was founded in 2015 by Chris Monroe and Jungsang Kim. IonQ's quantum computer is designed to be scalable, error-corrected, and fault-tolerant, and is expected to be able to solve problems that are intractable for classical computers. The company has partnerships with Microsoft, Amazon Web Services, and others. IonQ has raised over $225 million in funding to date.
Learn more about IonQ
Size
100 employees
Market Cap
$633 million
Industry
Founded
2016
NASDAQ

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