Job DescriptionAs a
Staff PIC Process Development Engineer, you will be a senior individual contributor within Nokia's
Optical Components organization, responsible for the development, optimization, and transfer of
InP photonic integrated circuit (PIC) and laser fabrication processes for
high-volume manufacturing.
This role requires deep technical expertise across epitaxial design, semiconductor processing, data-driven manufacturing analysis, and close collaboration with
remote fabrication partners. You will play a key role in enabling next-generation optical component technologies that support Nokia's high-capacity optical networking platforms.
ResponsibilitiesProcess Development & Integration- Lead the design, development, and optimization of InP PIC and laser fabrication processes for high-volume manufacturing
- Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
- Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
- Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules
Manufacturing Data & Yield Excellence- Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
- Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
- Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
- Define and utilize metrology strategies to ensure robust process control
Fab Execution & Cross-Functional Collaboration- Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
- Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
- Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp
Technical Leadership & Impact- Provide technical leadership within the PIC process development domain
- Contribute to continuous improvement of tools, methods, and best practices
- Mentor junior engineers and support knowledge transfer across the broader team
Qualifications- Ph.D. in Electrical Engineering, Physics, or a related field
- Minimum 3 years of industry experience developing and manufacturing InP PIC or laser fabrication processes for high-volume applications
- Demonstrated expertise in:
- Design of epitaxial layer structures
- Process design and fabrication process development for InP devices or PICs
- Photonic device data query and analysis in a manufacturing environment
- Metal, semiconductor, and dielectric deposition and etching tools, chemistries, and methods
- FMEA, SPC, process capability, and metrology
- Building end-to-end fabrication process flows from tool and design specifications
- Proven ability to work effectively with remote fabs and cross-site teams
Preferred Qualifications- Experience supporting technology transfer to high-volume manufacturing
- Familiarity with yield ramp, qualification, and reliability testing for photonic devices
- Strong communication skills with the ability to translate complex technical issues across disciplines
- Experience working in foundry or captive fab environments supporting compound semiconductor technologies
