Micron Technology

Staff Physical Design Engineer, HBM

Micron Technology$130K — $155K *
Consumer Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 7+ years of experience in digital physical design or related field
  • Bachelor's degree in Electrical Engineering; Master's preferred
  • Strong knowledge of RTL-to-GDSII design flow
  • Experience with full-chip integration and partitioning
  • Proficient in scripting/programming (TCL, Python, etc.)
  • Understanding of low-power architectures and power integrity analysis
  • Ability to effectively communicate and collaborate in cross-functional teams

Responsibilities

  • Lead physical design from netlist to GDSII, covering floorplanning to signoff
  • Leverage AI-Enabled tools within the design flow for efficiency
  • Drive timing closure across multiple scenarios using STA tools
  • Analyze and fix timing, power integrity, and congestion challenges
  • Refine power grids and clocking strategies for optimal performance
  • Collaborate with RTL designers on micro-architecture and constraints early on
  • Implement low-power techniques such as power gating and multiple domains
  • Validate physical designs against verification standards
  • Drive ECOs to achieve design performance targets
  • Automate workflows using scripting for productivity enhancements
  • Interface with EDA vendors to troubleshoot and improve design methodologies

Benefits

  • Health, dental, and vision insurance
  • 401(k) retirement plan with company match
  • Flexible working hours and remote work options
  • Employee assistance programs
  • Opportunities for professional development and further education
  • Work on cutting-edge technology in a collaborative environment
Full Job Description
Micron's High-Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high-performance, low-power digital logic used in advanced memory products. This role spans backend implementation from Netlist to GDSII, with a strong focus on timing closure, power integrity, and manufacturability in advanced process technologies. The successful candidate will work closely with RTL, DFT, CAD, and verification teams to deliver high-quality physical designs, contribute to methodology improvements, and help push performance, power, and area (PPA) targets in complex, multi-hierarchy designs.

Key Responsibilities:
  • Own and execute physical design implementation from synthesized netlist through GDSII, including floorplanning, placement, clock tree synthesis, routing, and physical signoff
  • Utilize AI-Enabled tools in the Netlist to GDS flow
  • Perform and drive timing closure across multiple modes, corners, and scenarios using industry-standard STA tools
  • Analyze and resolve congestion, timing, IR drop, EM, and power integrity issues
  • Develop and refine floorplans, power grids, and clocking strategies for high-performance designs
  • Work with placement and timing closure of custom analog hard IP macros in a digital-on-top design flow
  • Collaborate closely with RTL designers to influence partitioning, constraints, and micro-architecture decisions early in the design cycle
  • Implement and validate low-power design techniques, including multiple/isolated power domains, power gating, and UPF/CPF-based power intent
  • Execute physical verification (DRC/LVS/ANT/DFM) and support signoff flows
  • Drive functional and timing ECOs as needed to meet design targets
  • Use scripting and automation (TCL, Python, etc.) to improve productivity, quality, and flow robustness
  • Interface with EDA vendors and internal CAD teams to debug tool issues, evaluate new tools and functions, and improve physical design methodologies.


Required Qualifications
  • Strong understanding of the RTL-to-GDSII physical design flow particularly floorplanning, place & route, clock distribution, and timing analysis and closure using standard EDA tools and advanced process technologies
  • Experience with full-chip integration, partitioning, and budgeting
  • Solid understanding of power, performance, and area tradeoffs
  • Knowledge of low-power architectures, including DVFS, power gating, and multi-voltage designs
  • Proficiency in scripting/programming (TCL , Python, Perl, Shell scripting)
  • Strong problem-solving skills and ability to debug complex physical design issues
  • Effective communication skills and ability to work in a cross-functional team environment
  • Experience in validating Power Distribution Network (PDN), IR/EM


Preferred Qualifications:
  • Experience with advanced technology nodes
  • Experience with high-frequency, high-density designs and complex clocking schemes
  • Familiarity with memory, HBM, or datapath-intensive designs
  • Understanding of device physics and process-technology impacts
  • Experience in the 3D-IC technology, methodology, and advanced packaging and thermal considerations


Education and Experience:
  • Required: Bachelor's degree in EE with good understanding of computer architecture and 7+ years experience in related field
  • Desired: Master's degree in EE / CE with 5+ years experience in related field

About Micron Technology

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Learn more about Micron Technology
Size
43,000 employees
Market Cap
$53.7 billion
Industry
Net Income
$2.9 billion
Founded
1978
5 Year Trend
+8.6%
Revenue
$22 billion
NASDAQ

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