Micron Technology

Staff Physical Design Engineer, HBM

Micron Technology • $130K — $155K *
Richardson, TX 75080In-Person
Consumer Technology
5 - 7 years of experience
Today
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Job Overview by Ladders

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field.
  • 7+ years of hands-on experience in advanced-node physical design.
  • Tape-out experience on HBM, DRAM, or large memory-centric designs.
  • Deep expertise in floorplanning, timing closure, power integrity, and physical signoff.
  • Demonstrated ability to lead complex designs through silicon bring-up.
  • Expert-level experience with Cadence Innovus and/or Synopsys ICC2 / Fusion Compiler.
  • Proficient in PrimeTime STA and familiar with Calibre DRC/LVS.

Responsibilities

  • Drive physical design for HBM base die and/or memory dies from netlist through GDSII.
  • Own floorplanning and power planning for high macro density HBM designs.
  • Define HBM-specific architecture, including PHY placement and TSV regions.
  • Make architecture-level tradeoffs to optimize design performance.
  • Assist in power delivery network design for high current density environments.
  • Drive closure on IR drop, EM, and thermal issues across operating modes.
  • Ensure foundry reliability compliance and manage timing closure across corners.

Benefits

  • Mentorship opportunities for both junior and senior engineers.
  • Engagement in leading-edge HBM design projects.
  • The chance to influence and shape the memory architecture and interface definitions.
  • Collaborative work environment with cross-functional teams.
  • Opportunities for advancement and contribution to design innovations.
Full Job Description
Responsibilities will include, but are not limited to:
  • Drive end-to-end physical design for HBM base die and/or memory dies from netlist through GDSII.
  • Own floorplanning, power planning, placement, CTS, routing, and signoff for HBM designs with very high macro density.
  • Define and drive HBM-specific physical architecture, including channel partitioning, PHY placement, and TSV keep-out regions.
  • Work with design to make architecture-level tradeoffs to optimize bandwidth, latency, power, and yield.
  • Assist power delivery network (PDN) design for extremely high current density environments.
  • Drive IR drop, EM, and thermal closure across all operating modes.
  • Ensure compliance with foundry reliability rules, including EM lifetime, via density, and TSV stress considerations.
  • Own timing closure across corners for high-speed internal logic and HBM PHY interfaces.
  • Partner with clocking and PHY teams on clock distribution, skew control, and jitter sensitivity.
  • Collaborate with packaging teams on 2.5D interposer-based integration and HBM stack interfaces.
  • Ensure physical alignment of micro-bumps, TSVs, RDLs, and keep-out zones.
  • Own physical signoff readiness: STA, IR/EM, SI, DRC, LVS, density, and reliability.
  • Leveraging AI in LVS/DRC fix automation throughout the design phase.
  • Lead ECO strategies, including late-stage timing and power fixes.
  • Act as a key technical voice in tape-out and executive design reviews.
  • Partner with memory design, PHY, RTL, synthesis, DFT, SI, packaging, and test teams.
  • Influence memory architecture and interface definitions to improve physical feasibility.
  • Mentor senior and junior engineers; establish HBM-specific PD best practices and methodology.
  • Drive flow improvements, automation, and reuse across HBM generations.

HOW TO QUALIFY
  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
  • 7+ years of hands-on experience in advanced-node physical design.
  • Proven tape-out experience on HBM, DRAM, or very large memory-centric designs.
  • Deep expertise in:
    • Floorplanning and hierarchical PD
    • Timing closure and STA fundamentals
    • Power integrity (IR/EM) and thermal awareness
    • Physical signoff for advanced technologies
  • Demonstrated ability to lead complex designs through successful silicon bring-up. Strong problem-solving skills and ability to work independently on complex designs.
  • Expert-level experience with Cadence Innovus and/or Synopsys ICC2 / Fusion Compiler.
  • Strong proficiency in PrimeTime STA.
  • Experience with RedHawk, or equivalent PI tools.
  • Familiarity with Calibre DRC/LVS and advanced foundry signoff flows.
  • Experience with FinFET and sub-10nm nodes strongly preferred.

Preferred Qualifications
  • Direct experience with HBM2E / HBM3 / HBM3E products.
  • Understanding of TSV-based designs and micro-bump layouts.
  • Experience with die-to-die interfaces and wide parallel buses.
  • Knowledge of advanced packaging (2.5D interposer, chiplets).
  • Strong Tcl / Python scripting for PD flow automation.

About Micron Technology

Micron Technology Careers

Join the vibrant team at Micron Technology, a leader in memory and storage solutions, and propel your career into the future of technology. At Micron, we are committed to fostering a culture of diversity and innovation, offering a range of job opportunities that encourage professional growth and leadership development.

Work You’ll Do

At Micron Technology, you will collaborate with some of the brightest minds in the industry, working on groundbreaking projects that redefine how the world uses information to enrich life. Our team is dedicated to leading through a unique position in the marketplace, at the intersection of technology, industry expertise, and digital innovation.

Explore Micron Technology’s Career Opportunities

Whether you are looking for an internship, a full-time position, or a leadership role, Micron offers a path to personal and professional growth. We are hiring across multiple disciplines, seeking passionate, curious, and innovative team players.

Innovative Work

Join our global team of professionals and be part of a company that values innovation and leadership. Micron provides targeted solutions and technologies that are integral to advancing how the world works, learns, and plays.

Be Part of a Great Team

Experience Micron’s inclusive culture where we value diversity and provide extensive benefits to ensure the well-being of all our team members. Engage in networking opportunities within the company to expand your skills and advance your career.

Future-Proof Your Career

Micron is dedicated to your career development, offering unmatched training, development programs, and certification support to help you reach your goals. Our commitment to innovation and leadership in the memory and storage industry ensures that your work at Micron is not just a job, but a pathway to future opportunities.

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Learn more about Micron Technology
Size
43,000 employees
Market Cap
$53.7 billion
Industry
Manufacturing & Automotive
Net Income
$2.9 billion
Founded
1978
5 Year Trend
+8.6%
Revenue
$22 billion
NASDAQ
MU
* Ladders Estimates

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