Qorvo is seeking an IC Substrate Development Engineer with proven experience in high-density PCB interconnect substrates for semiconductor applications. This role is part of Qorvo's RF Packaging Center of Excellence in Greensboro, NC.
In today's rapidly evolving RF market, packaging innovation is a key strategic differentiator. In this role, you will leverage your substrate development expertise to partner with suppliers and cross-functional design teams to develop next-generation substrate technologies from concept through high-volume manufacturing.
Strong communication and collaboration skills are essential, as you will work closely with business unit design teams in a dynamic, fast-paced environment.
This is a fully onsite position (5 days/week). The preference is for this position to be located in our Greensboro NC office but we are also open to this position being located at our offices in Apopka FL or Richardson TX.
Responsibilities include:- Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
- Develop, qualify, and support clean launch of new laminate PCB material sets and suppliers in line with centralized Qorvo processes and documentation standards.
- Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
- Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
- Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
- Travel to laminate suppliers to provide technical support for technology development, supplier qualification and problem resolution.
Required Experience:- 8+ years of experience (or an equivalent combination of advanced education and experience) in PCB and/or IC substrate manufacturing
- Bachelors degree in Chemistry or an Engineering discipline
Required Skills:- Strong communication skills
- Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc.
- Industry knowledge and experience with laminate/PCB manufacturing including processes such as Cu pattern plating, panel plating, via drill, surface finishes, etc.
- Knowledge of dielectric materials such as prepreg, ABF, RCC, etc.
- Recognized understanding of IPC PCB and JEDEC standards
- Strong background in PCB design rules, manufacturing and qualification standards.
- Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
- Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high volume-manufacturing environment.
- Knowledgeable and up to date network within subcontractors to support advanced packaging technology.
- Proven record of accomplishment in supporting New Product, Processes, and/or Technology through innovative packaging solutions.
Preferred Skills:- Direct experience with Cu plating and/or surface finish plating.
- Project management skills, PMP.
- Experience in mSAP laminate fabrication for RF applications.
This position is not eligible for visa sponsorship by the Company.
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