Full Job Description
This role will be responsible for the development of advanced packaging solutions for semiconductor devices across various market segments. The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost. Candidates will be expected to:
- Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
- Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
- Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.
- Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.
- Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
- Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
- Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
- Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.
Qualifications
- PhD or Master’s degree in Mechanical Engineering or Electrical Engineering.
- 5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
- Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
- Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
- Hands-on experience with major FEM tools; ANSYS experience is preferred.
- Experience with FloTHERM, Sigrity, or Icepak is a plus.
- Experience with Cadence Allegro is a plus.
- Strong analytical, problem-solving, communication, and collaboration skills.
- Ability to work effectively in cross-functional teams and influence technical decisions across organizations.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $113,190 to $163,905.
- Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
- This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
