Doctorate/Masters/Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
10-15 years of experience in package development, focusing on power SiP/module, wafer level & flip-chip LGA packaging.
Strong knowledge of power SiP/modules with substrate or embedded components, assembly processes, and qualification methods.
Familiarity with statistical process control and analysis software, with knowledge of Cu FSM/BGBM technologies being advantageous.
Excellent interpersonal, communication, analytical, and presentation skills.
Responsibilities
Design and develop packaging and interconnect methods for various power applications.
Create Cu RDL and manage backside metal deposits on IC wafers.
Develop and implement wafer thinning processes utilizing Taiko BG and glass carrier bonds.
Define specifications for substrate and die interconnections, including materials and PCB interfaces.
Qualify packaging technologies for both consumer and automotive power applications.
Benchmark and select effective materials and processes, working with subcontractors and manufacturers.
Collaborate with OSAT/CM to optimize processes and establish specifications.
Benefits
Comprehensive benefits package including health and wellness resources.
Opportunities for ongoing professional development and training.
Collaborative work environment with an emphasis on innovation.
Involvement in cutting-edge projects within the power technology sector.
Full Job Description
Job Description
Design and develop package and interconnect methods for Renesas's packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging.
Develop Cu RDL with seed layer on IC wafer and FET and Backside metal deposit after grinding
Wafer thinning development through Taiko BG and Glass carrier bond
Define substrate, die interconnection through via, materials and PCB interface requirements
Package technologies qualification for consumer & industrial power as well as automotive power applications.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
Resolve all process integration issues by ensuring all window checks are done on critical process steps.
Establish production controls and monitor to ensure there is no room for quality incidents.
Ensure smooth transition into production & implement ramp up monitor.
Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
Participate in packaging roadmap development & focus on execution.
Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
Establish & maintain package design rules
Qualifications
Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.
Additional Information
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
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About Renesas Electronics America
Renesas Electronics America is a leading supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices, with operations spanning research, development, design and manufacturing for a wide range of applications.
