Sr. Principal AI Interconnect Architect

Compunnel

$150K — $200K *
Enterprise Technology
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Master's or Ph.D. in Electrical Engineering, Computer Engineering, or Computer Science
  • 10-15 years developing interconnect technologies like transport protocols and switching fabrics
  • Familiar with fabric topologies such as Fat Tree, Leaf-Spine, Torus, and Meshed
  • Strong knowledge of AI hardware architecture including GPU/accelerator clusters
  • Deep expertise in interconnect technologies like PCIe, CXL, NVLink, and Ultra Ethernet
  • Ability to develop performance models using advanced modeling techniques

Responsibilities

  • Develop architectures for chip-to-chip interconnects and switched fabrics focused on AI/ML
  • Analyze trade-offs in bandwidth, latency, power, area, and reliability for optimal performance
  • Participate in industry standard bodies to shape future specifications
  • Collaborate with SoC, package design, and software teams for seamless integration of interconnect solutions

Benefits

  • Opportunities for professional development and advancement
  • Participation in influencing industry standards
  • Engagement in innovative and cutting-edge projects
  • Cross-functional teamwork within a collaborative environment
Full Job Description
Job Summary

The AI Interconnect Architect designs and engineers high-speed networking and communication systems for AI inference infrastructure, including servers, racks, and chips. This role focuses on delivering bandwidth, power efficiency, scalability, and optimized transport protocols while leveraging advancd interconnect technologies such as PCIe, CXL, co-packaged optics, UALink, and Ultra Ethernet. The architect will define innovative scale-out architectures to optimize power, cost, and performance across diverse workloads.

Key Responsibilities

  1. System Architecture & Design: Develop architectures for chip-to-chip interconnects and switched fabrics tailored for AI/ML scale-out.
  2. Performance Optimization: Analyze trade-offs in bandwidth, latency, power, area, and reliability to ensure optimal system performance.
  3. Technology Development & Standards: Participate in industry standard bodies to contribute, influence, and shape future specifications.
  4. Cross-functional Collaboration: Partner with SoC, package design, and software teams to ensure seamless integration of interconnect solutions.


Required Qualifications

  • Master's or Ph.D. in Electrical Engineering, Computer Engineering, or Computer Science.
  • 10-15 years of experience developing interconnect technologies, including transport and link-level protocols, switching fabrics, QoS, reliable communication methods, and Software Defined Networking.
  • Familiarity with fabric topologies such as Fat Tree, Leaf-Spine (Clos), Torus, and Meshed, with an understanding of their applicability to different workloads and system configurations.
  • Strong knowledge of AI hardware architecture, including GPU/accelerator clusters and data center infrastructure.
  • Deep expertise in interconnect technologies and protocols such as PCIe, CXL, NVLink, UALink, Ethernet, Ultra Ethernet, and serial links.
  • Ability to develop performance models through advanced modeling and simulation techniques.


Preferred Qualifications (if any)

  1. Experience influencing industry standards and contributing to technical working groups.
  2. Demonstrated leadership in guiding cross-functional teams on interconnect architecture strategies.


Certifications (if any)

  1. Relevant certifications in networking, interconnect technologies, or AI hardware architecture (preferred but not required).

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