Leading the manufacturing of AI Servers and Systems based on Trainium chips across cross-geographical ODMs and CMs. As part of the Manufacturing, Quality and Reliability Team in AWS Annapurna Labs focused on Machine Learning products that designs cutting AI platforms for the world's largest Cloud Services provider.

The Trainium Manufacturing, Quality and Reliability Team is part of Annapurna Labs focused on Machine Learning products that designs cutting AI platforms for the world's largest Cloud Services provider. We are seeking a talented and motivated Manufacturing Engineer with a proven track record of implementing best in class test techniques and processes within a complex supply chain. As a member of the Cloud-Scale Machine Learning Acceleration team, you will be the interface between the system engineering team and the ODM and CM partners.

As a Senior Manufacturing Engineer you will engage with an experienced cross-disciplinary staff to conceive and design infrastructure technologies. You will work closely with an internal inter-disciplinary team, and outside partners to drive key aspects of product definition, execution and test in manufacturing. A successful candidate will be responsive, flexible and able to succeed within an open collaborative peer environment. You will:

* Work with the Design Engineering team to provide PCB/PCBA DFM feedback. Identify and escalate PCBA manufacturing challenges early in product development.

* Identify opportunities for risk reduction and simplification of PCBA manufacturing processes.

Deliver manufacturing processes capabilities including equipment capability, quality controls, materials characterization, and standardized rework practices.

* Investigate and develop new manufacturing technology and methodologies to enhance PCBA quality, reliability, throughput, and cost.

* Drive the PCBA Manufacturing Qualification process at the CM. Define manufacturing readiness requirements and lead key milestone reviews to ensure all production readiness deliverables are complete.

* Lead identifying and validating product/component risks and work with design teams to mitigate them and define the test methodology and test coverage to assure product quality

* Drive closure of all operational issues during pre-production builds. Work within Operations, Supply Chain, R&D, and Reliability Engineering to implement and optimize manufacturing processes and improve yields for production ramp.

* Investigate failures/defects in production, test, and integration. Identify and mitigate underlying root causes to prevent reoccurrence as part of continuous improvement efforts.

* Actively monitor the success of products and processes through production ramp. Provide regular status reports of PCBAs progress from design to production.

* Provide technical leadership and mentor engineers.

* Working with multiple vendors and ODMs to standardize component manufacturing and reliability expectations.

The successful candidate will be capable of making wide-ranging business decisions on behalf of the organization and willing to "roll up sleeves and do what needs to get done" to consistently deliver results. We're changing an industry, and we want individuals who are ready for this challenge.

Key job responsibilities

- Work with system engineering teams to identify and escalate manufacturing challenges by enforcing DFM, DFA and DFS principles

- Evaluate, investigate and introduce new manufacturing technology and methodology to enhance product quality and production efficiency at ODM and CM

- Develop or adapt manufacturing process at the ODM and CM, including defining fixture requirements, critical assembly requirements, test methodology, signal integrity, power and heat management requirement

- Drive all factory-related operational issues related to assembly processes during pre-production builds; ensure effective closure to enable operational success of the new product introduction cycle, and put products into mass production

- Manage product lifecycle changes, lead product quality and reliability improvement projects, and drive technical root cause for supplier defects

- Implement and optimize manufacturing 1st pass yields and efficiency from prototype through product ramp

- Work with engineering teams to clearly represent process and reviews to enable smooth New Product Introduction and changes

- Support cost reduction and sustaining activities

About the team

Annapurna Labs is a wholly owned subsidiary of AWS, focused on developing custom silicon and servers including the Nitro(K2), Graviton, Inferentia, and Trainium families of processors.

Machine Learning Annapurna functions as a vertically integrated team including software, firmware, hardware, and silicon design in a single organization.

We are the Trainium Servers and Systems organization under MLA focused on Hardware Development, Software Development, Fleet Ops Systems, and Manufacturing, Quality, and Reliability.

This position is in the Manufacturing, Quality and Reliability team.

BASIC QUALIFICATIONS

- 6+ years of root cause analysis and process design experience

- 7+ years of including new product introduction (NPI) experience

- Bachelor's degree or above in Mechanical, Electrical, Industrial Engineering, or related STEM field

- Experience: 5+ to 8+ years in SMT and PCBA process engineering, including high-volume production.

- Technical Skills: Deep knowledge of SMT line processes (stencil, SPI, pick-and-place, reflow, AOI, X-ray).

- Manufacturing Knowledge: Expertise in Design for Manufacturability (DFM) and Design for Testability (DFT).

PREFERRED QUALIFICATIONS

- Master's degree or equivalent, or experience with DFx (Design for cost, test, manufacturing)

- Education: Master's degree in Electrical, Mechanical, or Manufacturing Engineering.

- Industry Standards: Expert knowledge of IPC-A-610H, J-STD-001H, IPC-A-600, and IPC-7711/21.

- Process Knowledge: Strong experience with SMT lines, including stencil printing, Pick & Place, Reflow, Automated Optical Inspection (AOI), 5DX, and conformal coating/underfill application.

- Testing & Analysis: Experience with flying probe testing, Design of Experiments (DOE), and root cause analysis tools like 8D or Six Sigma.

- Software/Systems: Familiarity with PLM/PDM systems (Agile, Teamcenter, SAP) and ERP/MES systems.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, CA, Cupertino - 183,000.00 - 247,600.00 USD annually

USA, TX, Austin - 159,200.00 - 215,300.00 USD annually