Full Job Description
DUTIES: Lead Integrate Circuit (IC) Packaging Technologies Roadmap for all of the organization's products. Lead the execution of R&D Projects for the Short- and Long-Term roadmap. Oversee the development and hiring of highly skilled technical personnel. Lead R&D skunkworks technologies for 3+ years roadmap. Ensure that Qorvo manufacturing internal or external sites are ready with leading technology (materials, design rules, new packaging, and equipment capabilities).This includes working with: Assembly Processes, IC Packaging Technologies, and High-Volume Manufacturing; understanding packaging technologies for diverse packages to include four of the following: DSMBGA, DSMLGA, LGA, MCM, WLCSP, or Leadframe, etc., for addressing company needs & offer cost-quality effective solutions; systematically maintain technology leadership on packaging design rules for optimizing modules in terms of performance, cost of ownership & size; implement a system for ideating, qualifying & deploying technologies for smooth New Product Introduction execution; management experience in Packaging and Assembly of Semiconductors, and with System in Packages; assembly process such as SMT, Die Attach, Wire Bond, Molding, Marking, and Shielding; methodologies such as Six Sigma, Lean; and strong High Volume manufacturing experience in semiconductor assembly technologies/products. Includes occasional domestic travel to meet with customers and international trips two to three times a year.
MINIMUM REQUIREMENTS: Bachelor's degree in Electrical Eng.'g., Mechanical Eng.'g., Semiconductors, Materials, or Electronic Engineering, or related field, and 12 years of experience stated herein to involve: (1) Assembly Processes, IC Packaging Technologies, and High-Volume Manufacturing; (2) understanding packaging technologies for diverse packages to include four of the following: DSMBGA, DSMLGA, LGA, MCM, WLCSP, or Leadframe, etc., for addressing company needs & offer cost-quality effective solutions; (3) Systemic Design Rule Improvement Plan to include systematically maintain technology leadership on packaging design rules for optimizing modules in terms of performance, cost of ownership & size; (4) Systemic packaging technology development to include implementing a system for ideating, qualifying & deploying technologies for smooth New Product Introduction execution. Additionally, 10 yearsof experience stated herein to involve: (a) Management experience in Packaging and Assembly of Semiconductors, and with System in Packages; (b) assembly process such as SMT, Die Attach, Wire Bond, Molding, Marking, and Shielding; (c) methodologies such as Six Sigma, Lean; and (d) strong High Volume manufacturing experience in semiconductor assembly technologies/products. Includes occasional domestic travel to meet with customers and international trips two to three times a year.
This position is not eligible for visa sponsorship by the Company.
