The Manufacturing Engineering organization at Micron's Idaho F4 High Volume Manufacturing (HVM) site is responsible for enabling world-class manufacturing performance as ID1, the newest memory fab in the United States, ramps to scale. The team partners closely with global manufacturing sites, technology development, and central engineering organizations to deliver safe, high-quality, and cost-effective operations. The Sr. Manager of Dry Etch Manufacturing Engineering leads the strategy, execution, and performance of the Dry Etch department at the Idaho F4 HVM site. This role is accountable for building and developing high-performing technical teams, optimizing manufacturing output and yield, and aligning departmental priorities with Micron's business plan and strategic objectives. Responsibilities: - Formulate the strategic vision for your department and manage resources to support it. Concentrate on Dry Etch process capability, tool performance, and fleet scalability. - Drive fab optimization by improving output and yield while reducing operational costs and maintaining outstanding quality standards. - Lead Dry Etch process and equipment improvement efforts, including optimization of RF power delivery, gas chemistries, and endpoint detection systems. - Work together with Technology Development, Process & Equipment Engineering, Facilities, and our worldwide manufacturing network to guarantee alignment with Micron's business plans and strategic objectives. - Employ advanced analytics and AI/ML-powered solutions to elevate manufacturing performance, incorporating Fault Detection & Classification (FDC) and predictive maintenance for etch tools. Minimum Qualifications: - Proven track record of leading teams toward common goals within semiconductor manufacturing, with strong preference for Dry Etch or plasma processing experience. - Strong knowledge of manufacturing team structure, standards, and processes, including equipment engineering and process control in high-volume fabs. - Proven ability in leading teams and solving complex problems, particularly in etch process variability, defectivity, and tool performance. - Outstanding data analysis, problem-solving, and troubleshooting skills, with experience analyzing process trends, tool signals, and yield data. - Bachelor's degree or higher in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or related field, with previous leadership experience and a minimum of 5 years direct semiconductor experience. Preferred Qualifications: - Direct experience in Dry Etch manufacturing, including plasma etch systems, chamber tuning methods, and process improvement. - Proven ability to lead multiple complex projects simultaneously, including technology ramps and process transfers. - Strong organizational and prioritization skills in managing a large fleet of etch tools and competing production demands. - Outstanding communication skills to effectively present highly technical Dry Etch concepts and collaborate across engineering and operations teams. - Experience coaching and mentoring team members to support their career development and build next-generation Dry Etch technical leadership. - Experience and/or interest in developing Agentic AI workflows into current or future processes. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.