Job Summary:

CNPC USA is seeking a Senior Electrical Engineer - High-Temperature Downhole Systems to design and develop advanced electronics for MWD/LWD and other downhole sensing systems operating in high-temperature, high-pressure, shock, and vibration environments.

The primary focus of this position is the development of reliable high-temperature electronics for downhole applications, from architecture and design through qualification, field deployment, and commercialization. The position works collaboratively across electronics, firmware, sensors, mechanical packaging, testing, and field operations to support reliable system-level performance.

Key Responsibilities:

• Define and develop electronics architectures for MWD/LWD and other high-temperature downhole sensing systems, including power, analog front-end, signal conditioning, data acquisition, sensor interfaces, and telemetry interfaces.
• Lead the design, analysis, prototyping, testing, and characterization of high-temperature analog, digital, mixed-signal, and power electronics.
• Design and qualify electronics for reliable operation at 1756C and above in harsh downhole environments.
• Support the development and integration of high-temperature electronic technologies, including MCM, ASIC, SOI, hybrid electronics, and other applicable semiconductor technologies.
• Select, characterize, and qualify high-temperature semiconductor devices, passive components, substrates, interconnects, and packaging technologies for downhole temperature, pressure, shock, and vibration environments.
• Perform schematic design, circuit simulation, worst-case analysis, component derating, signal-integrity analysis, and thermal analysis as applicable.
• Develop and execute reliability and qualification programs, including high-temperature operating life, thermal cycling, shock/vibration, pressure testing, failure analysis, and root-cause investigation.
• Collaborate with firmware, sensor, mechanical, software, test, manufacturing, operations, and field teams to ensure system-level performance, data integrity, and reliability.
• Support laboratory testing, field deployment, troubleshooting, and product sustainment activities.
• Develop and maintain high-temperature electronics design standards, component qualification criteria, technical documentation, and engineering best practices.
• Coordinate technical activities with external design houses, foundries, component manufacturers, assembly/test suppliers, and other technology partners as required.
• Provide technical guidance and mentoring to engineers and other technical personnel.
• Contribute to invention disclosures, patent activities, and other intellectual property development, as applicable.
• Perform other duties as assigned.

Qualifications:

• Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related engineering discipline required; Master's degree or Ph.D. preferred.
• Minimum of 10 years of progressively responsible electronics engineering experience.
• Minimum of 5 years of experience developing electronics for MWD/LWD, downhole sensing systems, or other high-temperature/high-pressure downhole applications.
• Demonstrated experience designing and developing electronics for reliable operation at 1756C or above.
• Strong analog and mixed-signal design experience, including signal conditioning, data acquisition, sensor interfaces, precision references, power conversion, and related electronics.
• Experience with high-temperature component selection, characterization, derating, and qualification.
• Experience with electronics reliability testing, troubleshooting, failure analysis, and root-cause investigation.
• Proficiency with schematic capture, circuit simulation tools such as SPICE, and laboratory instrumentation.
• Demonstrated ability to work across electronics, firmware, sensors, mechanical packaging, and other engineering disciplines.
• Experience supporting multiple phases of the product development lifecycle, including design, prototyping, qualification, field testing, and/or commercialization.
• Strong technical communication, documentation, problem-solving, and collaboration skills.
• Must be authorized to work in the United States.

Preferred Experience:

• Experience developing MCM, ASIC, SOI, hybrid, or other high-temperature electronics technologies, including specification, design, packaging, testing, and qualification.
• Experience with high-temperature packaging and interconnect technologies, including ceramic substrates, thick-film or thin-film hybrids, die attach, wire bonding, and hermetic packaging.
• Knowledge of high-temperature electronics failure mechanisms, including electromigration, intermetallic growth, leakage, dielectric breakdown, and solder fatigue.
• Experience with downhole telemetry electronics, including mud-pulse or electromagnetic telemetry.
• Experience with directional sensor packages and MWD/LWD measurement systems.
• Experience with downhole data-acquisition architectures and hardware/firmware co-design.
• Experience with drilling-dynamics measurements, including vibration, shock, RPM, torque, WOB, or at-bit/near-bit sensing.
• Experience with pressure and temperature transducer electronics for HT/HP applications.
• Experience with high-temperature downhole power systems, including batteries, turbine alternators, and power conversion.
• Experience coordinating custom electronics or semiconductor development with design houses, foundries, packaging suppliers, and manufacturing partners.
• Experience with manufacturing test systems, qualification testing, and product commercialization.
• Publications or patents related to high-temperature electronics, downhole instrumentation, or related technologies.

Work Environment:

This position operates in a combination of professional office, engineering laboratory, and testing environments. The employee may work with electronics prototypes, laboratory instrumentation, thermal chambers, environmental test equipment, and other engineering and qualification equipment. The position may also require visits to manufacturing, testing, and field locations.

Physical Demands:

The physical demands described here are representative of those required to perform the essential functions of the position.

The employee is regularly required to communicate, use a computer and laboratory equipment, and perform engineering and testing activities. The position may require standing, walking, bending, reaching, and lifting or moving equipment or materials weighing up to 20 pounds.

Travel:

This position requires occasional domestic and international travel. Local travel between CNPC USA locations, laboratories, suppliers, and testing facilities may also be required.

Supervisory Responsibility:

This position has no direct supervisory responsibility. The position may serve as a technical lead and provide technical guidance and mentoring to engineers and other technical personnel.

Disclaimer: This job description is not intended to contain a comprehensive listing of all activities, duties, or responsibilities required of the employee. Duties, responsibilities, and activities may change or be assigned at any time, with or without notice.

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