Micron's Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Memory Design Engineer - Sustaining (Staff), you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products. You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates, supporting both silicon release and ongoing product lifecycle needs. This role requires strong AI driven technical execution and the ability to independently drive complex issues to closure. Responsibilities • HBM Design & Architecture: Participate on new HBM product design by collaborating with architecture team • Product Sustaining Work: Sustaining activities by fully owning and supporting one or more product through lifecycle (ECOs/spec changes). Work with PSE group on any silicon, system, and customer issues, driving root-cause analysis and resolution, reticle revision. • Cross-Functional Collaboration: Work closely with Architect, DE, PSE, TD, and system teams to execute issue resolution and ensure alignment on priorities. • Quality & Yield Improvement: Identify and debug yield, reliability, and performance issues to improve product quality. • Customer Support: Support customer bring-up, qualification, and system-level debug activities as needed. • Continuous Improvement: Contribute sustaining learnings to improve design quality, debug efficiency, and verification methodologies. Required Qualifications • Ph.D or 2+ years (MS) in Electrical Engineering, Computer Engineering, or related field • Strong understanding of DRAM/HBM architecture and high-speed memory interfaces • Experience in digital and/or custom design and verification • Hands-on experience in silicon debug or post-silicon validation • Ability to independently drive complex technical issues to closure • Proficiency in Artificial Intelligence (Claude Code or similar) in improving design quality and efficiency Preferred Qualifications • Experience with HBM/DDR/LPDDR or high-speed IO systems • Background in system-level debug and silicon-to-system correlation • Knowledge of timing and margin analysis, signal and power integrity • Experience with DFT / mBIST / test-mode debug • Programming/scripting skills (Python preferred) for debug automation • Strong communication skills with ability to work across cross-functional teams As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.