Purpose of the positionLead failure mode experiment analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as Cross-section/Dye & pry / Thrust & Pull/ Torsion etc. Experimental anomaly analysis SMT process defects, such as void, crack, cold solder using optical microscopy, data support for process optimization and collaborate with DFM teams to improve designs based on failure mode data. Develop test methodologies for new materials (low temperature solders, Flex PCBs)
Duties and Responsibilities1. Lead SMT failure mode experiment analysis: such as Cross-section, Dye &pry, Thrust-pullTorsion etc.
2. Preparation SMT failure mode experiment analysis report
3. Maintenance experimental equipment
4. Manage and training operation technicians
5. Optimize failure mode experiment analysis processes and methods to improve efficiency and accuracy
6. Support Line-qualification of SMT lines and progress tracking
Education and work experience Educational Requirements: Bachelor's degree or above
The best major in electronics,mechanical enigerring, chemistry and physics.
Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply.
Working conditions- Join a high-growth, innovation-driven team shaping next-gen consumer electronics.
- Work at the intersection of engineering, automation, and global operations.
- Be part of a diverse, bilingual team with strong cross-Pacific collaboration.
- Typically 8-5 core hours with flexibility, though project deadlines may require occasional overtime.
- Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
Skills: - The process is familiar with the experimental method and step
- Familiarity with SMT process flow is preferred.
