Full Job Description
We are looking for an experienced and detail-oriented SiP layout design engineer with strong expertise in laminate and PCB layout design for advanced semiconductor packaging applications. This role will support the development of flip-chip packages, system-in-package products, and module-based solutions across multiple market segments. Candidates will be expected to:
- Develop detailed laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions.
- Design and optimize routing, power and ground planes, via structures, escape routing, interconnect schemes, and substrate stack-ups to meet electrical, thermal, mechanical, and reliability requirements.
- Work closely with IC design, package engineering, and product engineering teams to ensure layout designs meet product specifications and package requirements.
- Perform design rule checks, layout verification, and design reviews to ensure compliance with package, substrate, PCB, and assembly design rules.
- Support layout feasibility studies, floor planning, package architecture selection, and design trade-off analysis for new package concepts.
- Generate and maintain layout databases, design documentation, fabrication drawings, stack-up drawings, and design review materials.
- Manage multiple layout projects, develop realistic layout schedules, track progress, and communicate status, risks, and issues to cross-functional teams.
Qualifications
- Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
- 5+ years of hands-on experience in laminate, substrate, PCB, or advanced package layout design.
- Strong understanding of laminate, substrate, and PCB layout principles, including routing, stack-up design, power/ground plane design, via design, impedance control, creepage/clearance, and manufacturability constraints.
- Strong knowledge of package structures, including BGA, LGA, flip-chip, system-in-package, multi-die packages, and module-based products.
- Proficiency in Cadence Allegro and CAD software.
- Familiarity with signal integrity, power integrity, thermal, mechanical, and reliability considerations in layout design.
- Ability to manage multiple projects, meet schedules, and deliver high-quality layout work with minimal supervision.
- Strong analytical skills, attention to detail, and ability to identify and resolve complex layout-related issues.
- Strong communication skills and ability to work effectively in cross-functional and global teams.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Job Req Type: Experienced
Required Travel: No
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $116,960 to $160,820.
- Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
- This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
