We are seeking a Signal or Power Integrity Engineer to join our hardware team and contribute to SI/PI analysis and optimization of advanced packaging solutions for next-generation machine learning and data center ASICs.

In this role, you will support the package-level signal or power integrity effort - performing detailed simulations, building models, and contributing to design decisions across IC, package, and board boundaries. You'll work closely with senior engineers to help ensure our advanced packaging technologies meet performance, power delivery, and manufacturing targets.

Key job responsibilities

- Perform package-level SI or PI simulations for 2.5D, 3D-IC, fan-out, and silicon interposer/bridge architectures under guidance from senior engineers.

- Support package stack-up design: assist with dielectric material evaluation, impedance control analysis, layer assignment, and RDL routing studies.

- Run high-speed channel simulations (S-parameter extraction, time-domain analysis, eye diagrams) for die-to-die and die-to-board interfaces, or analyze package PDN performance (decoupling effectiveness, plane resonance, IR drop, AC impedance).

- Model advanced interconnects: microbumps, C4 bumps, TSVs, microvias, PTH vias, and RDL traces for signal or power paths.

- Build and validate models for decoupling technologies such as on-die capacitance, deep trench capacitors (DTCs), or IPD capacitors as needed.

- Coordinate with SoC die-level teams and board design teams to gather requirements and support co-optimization of package architecture.

- Flag potential package manufacturing risks - warpage, via reliability, impedance variation - and propose mitigation approaches.

A day in the life

Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures, and we're building an environment that celebrates knowledge-sharing and mentorship. Our senior members enjoy one-on-one mentoring and thorough, but kind, code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.

Diverse Experiences

AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn't followed a traditional path, or includes alternative experiences, don't let it stop you from applying.

BASIC QUALIFICATIONS

- BS degree in electrical engineering or equivalent

- 5+ years of experience in signal integrity, power integrity, or package design

- Solid understanding of either SI (S-parameter extraction, crosstalk, return loss, channel analysis) or PI (PDN impedance analysis, IR drop, decoupling strategy), with working awareness of the other

- Experience with EM simulation and SI/PI tools such as HFSS, Cadence Sigrity (PowerSI, PowerDC, Clarity), ADS, or equivalent

- Understanding of advanced packaging technologies: 2.5D/3D-IC, silicon interposers, fan-out wafer-level packaging, RDL, TSVs, and microbump interconnects

- Familiarity with stack-up design and impedance control for multi-layer organic substrates or silicon interposers.

- Good communication skills with the ability to participate in technical discussions across silicon, package, and board teams

PREFERRED QUALIFICATIONS

- MS with 3+ years in signal integrity, power integrity, or package design

- Exposure to high-speed serial protocols (PCIe, UCIe, or custom SerDes) at the package level

- Experience correlating SI/PI simulations with lab measurements (TDR, VNA, oscilloscope)

- Familiarity with equalization techniques (DFE, CTLE, FFE) or PDN target impedance methodology

- Interest or experience in package co-design methodologies (chip-package-board co-simulation)

- Familiarity with high-density fan-out or silicon bridge packaging (e.g., EMIB, CoWoS, or similar)

- Exposure to package-level thermal-aware analysis, electromigration, or EMC/EMI considerations

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, CA, Cupertino - 157,300.00 - 212,800.00 USD annually

USA, TX, Austin - 136,000.00 - 184,000.00 USD annually