Signal Integrity Engineering Manager - High Speed Connectors

Amphenol ICC

$120K — $150K *
Telecommunications & Hardware
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • B.S. in Electrical Engineering required; M.S. preferred.
  • 10+ years of industry experience with engineering management of high-speed signal integrity teams.
  • Expertise in SI simulation tools like Ansys HFSS/Designer, CST Microwave Studio, or similar platforms.
  • Hands-on experience with high-speed measurements such as TDR, VNA, and pattern generators.
  • Preferred experience with high-speed connectors and interconnects in communication, server, or networking systems.
  • Strong leadership and communication skills to align cross-functional teams.

Responsibilities

  • Lead a team of signal integrity engineers in developing next-generation HSIO connectors.
  • Interface with customers and product managers to translate performance requirements into designs.
  • Own the signal-integrity aspect of new product development from architecture to manufacturing.
  • Conduct detailed design reviews collaborating with engineering teams to meet performance targets.
  • Collaborate closely with multiple engineering teams to ensure product performance and excellence.
  • Drive innovation and contribute to technology roadmaps by identifying emerging needs.
  • Mentor engineering team members, fostering their technical growth and alignment.

Benefits

  • Opportunities for professional development and training.
  • Supportive work environment with a focus on mentorship and team collaboration.
  • Access to cutting-edge technology and innovation initiatives.
Full Job Description
Signal Integrity Engineering Manager

Location: Schaumburg, IL.

RESPONSIBILITIES

As the Signal Integrity Engineering Manager for the HSIO Connector Business, you will lead a high-performing team responsible for developing next-generation high-speed connector systems-including SFP, QSFP, OSFP, CDFP, and 448G-class HSIO connectors.
  • Lead a team of signal integrity engineers developing next-generation HSIO connectors, including SFP, QSFP, OSFP, CDFP, and 448G-class high-speed connectors.
  • Interface with customers and internal product managers to translate performance requirements into connector designs, manufacturing processes, qualification plans, and production-ready solutions.
  • Own the signal-integrity portion of new product development-from architecture and simulation through validation, compliance testing, and transfer to global manufacturing sites.
  • Conduct detailed design reviews with SI, mechanical, and manufacturing engineering teams to ensure designs meet performance targets and follow best-practice methodologies.
  • Collaborate closely with mechanical, manufacturing, applications, and global factory engineering teams to ensure product performance and engineering excellence.
  • Contribute to technology and product roadmaps by identifying emerging needs, driving innovation, and presenting solutions to leadership and key customers.
  • Mentor and guide engineering team members, fostering technical growth, strong communication, and cross-functional alignment.
  • Establish and share best-practice methodologies for simulation, modeling, measurement, and design workflows across the organization.
  • Solve advanced high-speed challenges, including channel modeling, SI/PI simulation, characterization, VNA/TDR validation, and margin analysis for high-speed industry standards.
  • Support Sales and Applications Engineering teams during customer engagements, technical discussions, and new-design opportunities for HSIO connectors.
  • Support global production ramps by advising on build strategies, measurement techniques, design refinements, and establishing appropriate test limits for high-volume manufacturing.


QUALIFICATIONS
  • B.S. in Electrical Engineering required; M.S. preferred.
  • 10+ years of industry experience and proven engineering management experience leading high-speed signal integrity teams.
  • Expertise with SI simulation tools such as Ansys HFSS/Designer, CST Microwave Studio, or equivalent EM/SI platforms.
  • Hands-on experience with high-speed measurements: TDR, VNA, pattern generators, error detectors, and related debug methodologies.
  • Experience designing or applying high-speed connectors and interconnects in communication, server, or networking systems is strongly preferred.
  • Strong leadership, people management and communication skills with the ability to align cross-functional teams and influence technical direction.


SKILLS
  • Strong facilitation and team-building skills with the ability to integrate multiple engineering disciplines.
  • High attention to detailwith a strong systems-level perspective.
  • Ability to multitask, set priorities, and manage parallel engineering programs in a fast-paced environment.
  • Clear ability to articulate, document, and execute structured development processes.
  • Confident in presenting technical concepts to internal stakeholders and external customers.
  • Passion for mentoring, developing engineering talent, and fostering a high-performance technical culture.

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