Your RoleExperienced senior-level optical engineer to lead technology development for co-packaged optics (CPO). The role combines hands-on optical and SiPh device packaging engineering with project/technical management, vendor collaboration, cross-functional and global team leadership, and R&D to bring manufacturable CPO solutions to production. Candidate must have deep process engineering experience in SiPh packaging, semiconductor laser/device packaging, optical fiber handling, and/or semiconductor wafer processes.
What You Will Do- Lead technology development activities for CPO and associated optical packaging solutions.
- Define and execute packaging solutions R&D: die attach, adhesive selection, wire bonding, fiber attach, alignment, thermal and stress considerations, and material qualification.
- Plan and run feasibility studies, design-of-experiments (DOE), pilot builds, and reliability testing.
- Project and technical management (planning, schedules, budgets, risk management, vendor coordination).
- Manage and lead cross-functional teams (design, manufacturing, reliability, supply chain, quality) and collaborate with global sites/vendors.
- Hands-on lab/bench work: prototyping, process setup, process optimization, optical fiber handling, optical alignments, test automation, and test integration.
- Identify process/packaging yield drivers, implement corrective actions, and scale technologies toward production.
- Prepare technical documents, reports, presentations, and interact with external partners and suppliers.
- Mentor junior engineers and build team capabilities.
Core Competencies & Behavioral Skills- Leadership: able to lead technical teams and mentor others.
- Communication: clear technical writing, presentation, and stakeholder management.
- Problem solving: structured problem solving and root-cause investigation.
- Collaboration: successful cross-functional and global team player.
- Planning & Execution: organizes complex programs, meets milestones, manages risks.
Who You Are (Basic Qualifications)- Master's degree or higher in Optical Engineering, Physics, Electrical Engineering, Materials Science, or related field.
- Minimum 10 years of industry experience in optical packaging, SiPh packaging, or semiconductor laser/device packaging with strong process engineering background.
- Demonstrated hands-on experience in optical device packaging: die attach, adhesives, wire bonding, optical fiber management, optical alignment, materials selection.
- Strong knowledge of semiconductor wafer processes and interactions with packaging (e.g., thermal budgets, contamination control).
- Proven track record leading technology development projects and cross-functional/global teams.
- Excellent communication and people management skills; experience managing vendors and supplier qualification.
- Willingness and ability to travel as required (domestic and international travel).
- SiPh (silicon photonics) packaging and integration processes.
- Experience in process development and optimization related to optical devices.
- Optical fiber knowledge: theory, handling, cleaving, splicing, ferrule/array assembly, fiber pigtail techniques.
- Die attach processes, bonding materials (solders, adhesives), curing processes, and reliability implications.
- Thermal analysis and mechanical/stress analysis for packages.
- Materials science for packaging: coefficient of thermal expansion (CTE) mismatch mitigation, adhesives, and underfills.
- Wire bonding and alternative electrical interconnects; knowledge of flip-chip and other interconnect technologies.
- Test/measurement for optical devices: insertion loss, return loss, optical alignment tolerances.
- Familiarity with reliability testing standards (thermal cycling, HTOL, moisture, mechanical shock/vibration).
What Will Put You Ahead- Prior CPO development experience and understanding of system-level integration.
- Experience with design-for-manufacturability (DFM) and design-for-test (DFT) in optical packaging and optical devices.
- Background in automation for assembly/align/test, process control, and statistics (SPC).
- Multi-site/global program management experience.
- Experience with supplier development and contract/manufacturing scale-up.
For this role, we anticipate paying $160,000 - $220,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.
At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.
Hiring Philosophy All Koch companies value diversity of thought, perspectives, aptitudes, experiences, and backgrounds. We are Military Ready and Second Chance employers. Learn more about our hiring philosophy here .
Our Benefits Our goal is for each employee, and their families, to live fulfilling and healthy lives. We provide essential resources and support to build and maintain physical, financial, and emotional strength - focusing on overall wellbeing so you can focus on what matters most. Our benefits plan includes - medical, dental, vision, flexible spending and health savings accounts, life insurance, ADD, disability, retirement, paid vacation/time off, educational assistance, and may also include infertility assistance, paid parental leave and adoption assistance. Specific eligibility criteria is set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region. If you have questions on what benefits apply to you, please speak to your recruiter.
Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.
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