Position: Senior Mechanical Application Development Engineer - HSIO Connectivity and Thermal Solutions

Location: Santa Clara, CA

Position Overview

Amphenol High Speed Products Group is a global leader in high-speed interconnect solutions serving the AI, cloud, networking, storage, and telecommunications markets. Our innovative connector, cable assembly, and system-level solutions enable next-generation computing platforms deployed by the world's leading hyperscale, OEM, and ODM customers.

We are seeking a highly motivated Senior Application Development Engineer to drive the development and deployment of advanced High-Speed IO (HSIO) connectivity and liquid cooling solutions for next-generation AI and data center infrastructure. This role combines customer-facing technical leadership with product development, system architecture, and cross-functional engineering collaboration.

The successful candidate will work directly with hyperscale customers, OEMs, ODMs, and internal engineering teams to develop innovative interconnect and thermal management solutions that address complex system-level challenges. This position requires a strong understanding of high-speed connectivity, mechanical integration, thermal architecture, and customer-driven product development.

Key Responsibilities

Customer Engagement & Technical Leadership

• Serve as the primary technical interface between customers, ODMs, OEMs, and Amphenol engineering teams.
• Collaborate closely with customers to understand system requirements and recommend optimal HSIO interconnect and liquid cooling solutions.
• Influence customer platform architectures through technical consultation and early-stage design engagement.
• Provide guidance on product selection, integration strategies, performance optimization, and deployment best practices.
• Conduct technical reviews, training sessions, workshops, and customer presentations.
• Support strategic customer programs from concept through production deployment.

HSIO Connector & Cable Assembly Development

• Lead development and customization of high-speed connector solutions for AI, networking, storage, and server applications.
• Collaborate with product engineering teams to define electrical, mechanical, thermal, and manufacturability requirements.
• Support development of next-generation HSIO connector technologies up to 448G and beyond.
• Develop engineering concepts, prototypes, and demonstration systems to validate customer solutions.
• Create detailed engineering documentation, drawings, specifications, and application guidelines.

Liquid Cooling & Thermal Solution Development

• Partner with customers to develop liquid cooling architectures for AI servers, accelerators, networking equipment, and rack-scale systems.
• Integrate liquid cooling technologies with HSIO connector solutions while maintaining electrical, thermal, and mechanical performance requirements.
• Support evaluation and implementation of cold plates, manifolds, blind-mate fluid connectors, quick disconnects, CDUs, and rack-level cooling infrastructure.
• Collaborate with thermal engineering teams to optimize coolant routing, serviceability, reliability, and manufacturability.
• Support development, testing, and validation of thermal and mechanical prototypes.
• Troubleshoot integration challenges during customer development and deployment phases.

System Architecture & Solution Development

• Work with customers to define complete system-level architectures incorporating connectivity, cable management, thermal solutions, and mechanical packaging.
• Develop reference designs and integration methodologies for AI, HPC, networking, and cloud infrastructure platforms.
• Evaluate mechanical, thermal, manufacturing, and operational tradeoffs to optimize overall system performance.
• Support platform bring-up, validation, and qualification activities at customer and ODM sites.
• Develop tools, fixtures, and installation methodologies that improve deployment efficiency and serviceability.

Project Leadership & Cross-Functional Collaboration

• Manage multiple concurrent customer development projects through all phases of the product lifecycle.
• Coordinate activities among global engineering, product management, manufacturing, and sales organizations.
• Provide regular technical and program status updates to stakeholders.
• Drive issue resolution and ensure timely execution of project milestones.
• Leverage engineering resources across Amphenol divisions to deliver complete customer solutions.

Innovation & Industry Leadership

• Monitor emerging technologies and market trends in AI infrastructure, liquid cooling, high-speed connectivity, and rack-scale architectures.
• Generate innovative product concepts and support intellectual property development through invention disclosures and patent applications.
• Participate in industry events, standards activities, and customer technology forums.
• Contribute to long-term product and technology roadmaps.

Required Qualifications

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related engineering discipline.
• Minimum 7 years of industry experience in product development, application engineering, system architecture, or related technical roles.
• Experience with high-speed connectors, cable assemblies, interconnect systems, or related technologies.
• Strong mechanical design and engineering documentation skills.
• Experience interacting directly with customers in highly technical environments.
• Strong analytical, troubleshooting, and problem-solving skills.
• Excellent communication and presentation abilities.
• Ability to manage multiple projects simultaneously in a fast-paced environment.
• Willingness to travel domestically and internationally as required.

Preferred Qualifications

• Experience with AI servers, HPC systems, cloud infrastructure, networking equipment, or storage platforms.
• Experience with liquid cooling technologies and thermal management systems.
• Familiarity with blind-mate fluid connectors, quick disconnects, cold plates, manifolds, and rack-level cooling architectures.
• Understanding of signal integrity, power integrity, and high-speed channel design considerations.
• Knowledge of PCIe, Ethernet, InfiniBand, CXL, OCP, and related industry standards.
• Experience working with hyperscale customers and ODMs.
• CAD experience using SolidWorks, Creo, or equivalent platforms.
• Experience supporting product innovation, invention disclosures, or patent development.

The base salary range for this position, based in Santa Clara, CA, is $100,750 - $168,870 USD annually. In determining rate of pay, Amphenol considers a variety of nondiscriminatory factors, including but not limited to geographic location, relevant industry experience, qualifications, skills, and education. It would be rare for an individual to be hired at or near the top of the range for a given role. Base salary is one facet of Amphenol's total rewards package, which includes participation in our comprehensive benefits program with medical, dental, and vision benefits effective day 1, vacation, sick leave, personal days, paid holidays, life insurance, short/long term disability, and a matching 401K. Our Mechanical Application Development Engineers are also eligible to participate in an annual incentive bonus program.

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