Job Description

The candidate will be a member of a highly skilled and motivated engineering team and will be encouraged to take on the responsibility of a broad range of tasks. You will be responsible for transforming concepts into actual parts of the system, and testing the developed module, the system integration and verifying if requirements are met.

Responsibilities

Develop and optimize thermocompression, flip-chip and other advanced packaging processes in collaboration with our customers;

Serve as the lead technical interface to customers;

Creates specifications for required technical capabilities;

Test, troubleshoot and recommend improvements to advanced packaging assembly equipment;

Identifies, analyzes and resolves system design weaknesses;

Detailed data analysis;

Preparation of internal summary reports and customer presentations;

Provides multi-layered technical expertise for next generation initiatives;

Extensive traveling to visit customer sites to help our field team troubleshoot machine issues (up to 50%).

Qualifications

Bachelors or Masters Degree (Masters preferred) in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging;

Knowledge of the semiconductor packaging is a plus;

Hands-on, strong aptitude and deep understanding of highly advanced machinery;

Experience with flip chip, die attach or thermocompression bonding highly preferred but not required;

Strong data analysis skills, including working knowledge of Matlab and/or JMP, Minitab;

Ability to travel domestic and internationally up to 50%

Candidates with higher qualifications may be considered for a more senior position