Minimum qualifications:- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
- 7 years of experience with physical design (e.g. from RTL to GDSII, including key stages like floorplanning, place and route, and timing closure).
- Experience in Python, Tcl, or Perl scripting.
Preferred qualifications:- Experience working with external partners on Physical Design (PD) closure.
- Experience in Static Timing Analysis (STA), with an understanding of how to define timing corners, margins and derates.
- Experience with Synopsys/Cadence PnR tools.
- Experience with backend flows (e.g., LEC, PI/SI, DRC/LVS, etc.).
- Understanding of DFT including Scan, MBIST and LBIST.
- Understanding of performance, power and area (PPA) trade-offs.
About the jobIn this role, you'll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You'll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an ASIC Physical Design Engineer, you will collaborate with RTL, Design for Testing (DFT), Floorplan, and full-chip Signoff teams. Additionally, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $163000 - $237000 (USD) 15% bonus target equity benefits
Learn more about benefits at Google .
Responsibilities- Participate in the Physical Design of complex blocks.
- Contribute to the design and closure of the full chip and individual blocks from RTL-to-GDS.
- Collaborate with internal logic and internal and external teams to achieve the best Power/Performance Analysis (PPA). This includes conducting feasibility studies for new microarchitectures as well as optimizing runs for finished RTL.
