Overview

A major success factor for Keysight continues to be the development and deployment of breakthrough digital, analog, and mixed signal Application Specific Integrated Circuits (ASICs), modules, and subsystems that drive the performance, differentiation, and value of new products. We have an exciting opportunity for a highly motivated R&D Hardware Design Architect to join our ASIC Packaging, Subsystem, and Integration team. In this role, you will apply your experience and help lead architecture development for the world's highest performance test and measurement products including Oscilloscopes, Signal Generators, Bit-Error Rate Testers, and Frequency-Domain Instruments.

You'll collaborate across global teams to design, optimize, and implement subsystem solutions that meet test & measurement product functionality, performance, quality and schedule requirements. This role is part of Keysight Laboratories, a world-renowned technology organization which enables Keysight to be first to market with breakthrough products and solutions. We are located in Colorado Springs, Colorado at the base of Pikes Peak. Our beautiful development campus includes both office and advanced technology, assembly & machining facilities, as well as an 18-hole disc golf course, volleyball/basketball courts, a complete fitness center, and cafeteria. Our city is consistently rated as one of the best places to live in the United States. We enjoy bountiful outdoor access, year-round recreational opportunities, and over 300 days of sunshine per year.

Responsibilities
• Lead system and subsystem architecture development for advanced instrument platforms, defining partitioning, interfaces, performance budgets, and integration strategies across ASICs, FPGAs, analog/RF circuitry, power delivery, clocking, thermal, mechanical, and signal integrity domains.
• Own architecture tradeoff analysis and technical decision-making across performance, cost, manufacturability, reliability, schedule, and risk to deliver differentiated subsystem solutions.
• Translate product and technology objectives into subsystem requirements, top-level specifications, interface definitions, and validation plans that align cross-functional development teams.
• Drive cross-functional technical alignment across system, IC, package, PCB, firmware, software, test, reliability, and manufacturing teams from concept through production release.
• Model, analyze, and optimize high-frequency RF, microwave, and high-speed digital interconnects, including package, substrate, board, and module-level effects.
• Guide integration of critical ASIC and subsystem technologies into instrument products, ensuring functionality, performance, quality, and schedule objectives are achieved.
• Evaluate and select appropriate packaging, interconnect, and subsystem technologies for each design, while identifying and maturing next-generation solutions for future product roadmaps.
• Partner with internal and external manufacturing and supply chain teams to develop scalable implementation approaches, qualification strategies, and deployment plans for new technologies and processes.
• Collaborate with test and reliability teams to define characterization strategies, qualification requirements, failure analysis approaches, and lifecycle support plans for new and existing components.
• Serve as the senior technical contributor and architectural authority for subsystem integration, mentoring others and influencing design methodology, best practices, and long-term technical direction.

Qualifications
• BS, MS, or PhD in Electrical Engineering or a related field.
• 7+ years of experience in system architecture, subsystem design, hardware development, RF/microwave design, high-speed interconnects, advanced packaging, or closely related disciplines, with demonstrated ownership of complex technical solutions.
• Expert-level understanding of system and subsystem architecture principles, including requirements decomposition, interface definition, performance budgeting, tradeoff analysis, and cross-domain integration.
• Deep experience with semiconductor, package, module, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies.
• Strong expertise in RF/microwave theory, high-frequency circuit design, signal integrity, power integrity, and high-speed modeling and optimization.
• Strong foundation in thermal, mechanical, and materials considerations relevant to high-performance and high-power-density subsystem design.
• Demonstrated ability to lead technical direction across cross-functional teams and to influence architecture decisions across system, IC, package, board, test, and manufacturing organizations.
• Experience defining subsystem requirements, architecture specifications, integration strategies, and validation approaches for complex product developments.
• Familiarity with IC design methodologies, processes, and workflows is preferred.

Most offers will be between the minimum and the midpoint of the Salary Range listed below.

MIN $128,670.00- MAX $214,440.00

Note: For other locations, pay ranges will vary by region

This role is eligible for Keysight Results Bonus Program

US Employees may be eligible for the following benefits:

• Medical, dental and vision
• Health Savings Account
• Health Care and Dependent Care Flexible Spending Accounts
• Life, Accident, Disability insurance
• Business Travel Accident and Business Travel Health
• 401(k) Plan
• Flexible Time Off, Paid Holidays
• Paid Family Leave
• Discounts, Perks
• Tuition Reimbursement
• Adoption Assistance
• ESPP (Employee Stock Purchase Plan)
• Restricted Stock Units

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