Job Details:Job Description:About the RoleWe are seeking an experienced semiconductor
Failure Analysis Engineer responsible for debug and root cause analysis of yield, reliability and customer returns on FPGA's using advanced foundry process technologies. This role requires partnering with IC and Package design, Foundry Engineering, Product and manufacturing Engineering, and Reliability teams for driving systematic fault isolation and debug.
In this role, focus will be on non-destructive electrical fault isolation by debugging electrical test responses and circuit/layout analysis. Experience in using fault isolation using Photo Emission/Infrared microscopy (EMMI), Laser Voltage Probing (LVP) and Optical Beam Induced Resistance Change (OBIRCH) and other fault isolation tools is required.
Key Responsibilities- Collaborate with Product/Yield/Reliability Engineers to drive electrical verification, and fault isolation during product development, yield improvement and reliability risk assessments
- Support debug and fault isolation on customer returns
- Define, execute and interpret fault isolation methods as appropriate to non-destructively isolate a failure using commercial testers and fault isolation tools
- Proficient in independently using Emission microscopes, Laser Voltage Probing and OBIRCH tools
- Experienced with layout, schematic and design analysis tools
- Collaborate with physical failure analysis team on defect modes
Minimum Qualifications- BS degree in Electrical Eng, Materials Science, Physics, Mechanical Engineering or a related field
- 5-15 years of experience in semiconductor failure analysis
- Experienced in Layout & Design tools (Virtuoso, Avalon, SysNav, etc)
- Expertise in FA tools such as Laser Voltage Probing (LVP), Photo Emission EMMI, Optical Beam Induced Resistance Change (OBIRCH)
- DFT and logic fault localization knowledge.
- Proven ability to drive investigations to root-cause and to drive yield/reliability improvements.
- Strong analytical and problem-solving skills.
- Excellent written and verbal communication.
Preferred Qualifications- Understanding of FPGA architecture
- Understanding design debug features (DFT)
- Experience with using Teradyne Ultraflex tester
- Semiconductor packaging failure analysis.
Qualifications:Minimum Qualifications- Bachelor's degree in Electrical Eng, Materials Science, Physics, Mechanical Engineering or a related field
- 8+ years of experience in semiconductor failure analysis
- 8+ years of experience with Layout & Design tools (Virtuoso, Avalon, SysNav, etc)
- 8+ years of experience with FA tools such as Laser Voltage Probing (LVP), Photo Emission EMMI, Optical Beam Induced Resistance Change (OBIRCH)
- 8+ years of experience with DFT and logic fault localization knowledge.
- 8+ years of experience driving investigations to root-cause and to drive yield/reliability improvements.
Preferred Qualifications- 10+ years of experience in semiconductor failure analysis
- Understanding of FPGA architecture
- Understanding design debug features (DFT)
- Experience with using Teradyne Ultraflex tester
- Semiconductor packaging failure analysis.
Job Type: Regular
Shift:Shift 1 (United States of America)
Primary Location:San Jose, California, United States
Additional Locations: 
