Product Development / Mechanical Design Engineer - High Speed Connectors

Amphenol ICC

$90K — $120K *
Manufacturing & Automotive
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's degree in Mechanical or Electrical Engineering.
  • 5+ years of experience in connector or high-speed product development.
  • Proficiency in CAD tools (SolidWorks, Creo) and simulation software (ANSYS).
  • Strong understanding of signal integrity, EMI/EMC, and thermal management.
  • Experience with materials and manufacturing processes including stamping, plating, molding, and assembly.
  • Excellent communication skills with global teams and customers.
  • Ability to manage multiple projects and prioritize effectively.

Responsibilities

  • Lead concept generation, design, and qualification of high speed IO connectors for 112Gb+ signaling.
  • Develop connectors optimized for AI/ML workloads with emphasis on signal integrity, mechanical robustness, and thermal efficiency.
  • Apply advanced design techniques for low latency, high-density packaging, and manufacturability.
  • Collaborate with cross-functional teams to ensure system-level integration and compliance with industry standards.
  • Define and execute rigorous testing protocols for electrical, mechanical, and environmental performance.
  • Manage development projects from concept through production, including timelines and deliverables.
  • Act as the primary technical interface for customer engagements.

Benefits

  • Innovative work in connectivity solutions for next-gen AI/ML applications.
  • Opportunity to drive product development from concept to production.
  • Collaboration with cross-functional teams to enhance project scope.
  • Engagement with global technical teams and customers.
Full Job Description
Product Development / Mechanical Design Engineer - High Speed IO Connectors

The position will be located in Schaumburg, IL.

Position Overview

Amphenol is seeking a highly skilled and motivated Senior Product Development Engineer to lead the design and development of high speed IO connectors. This role is pivotal in advancing connectivity solutions for next-generation AI/ML platforms and high-bandwidth data center applications. The engineer will serve as the technical owner for a specific form factor, driving innovation, customer engagement, and cross-functional execution.

Key Responsibilities

Design & Innovation
  • Lead concept generation, design, and qualification of high speed IO connectors for 112Gb+ signaling.
  • Develop connectors optimized for AI/ML workloads with emphasis on signal integrity, mechanical robustness, and thermal efficiency.
  • Apply advanced design techniques for low latency, high-density packaging, and manufacturability.
  • Collaborate with cross-functional teams to ensure system-level integration and compliance with industry standards (e.g., OSFP, QSFP-DD, PCIe).

Testing & Validation
  • Define and execute rigorous testing protocols for electrical, mechanical, and environmental performance.
  • Perform Design FMEA, Tolerance Analysis, DFM, FEA (ANSYS preferred), and Risk Analysis.
  • Work with internal labs and external partners to validate performance in real-world environments.

Project Management
  • Manage development projects from concept through production, including timelines, deliverables, and cross-functional coordination.
  • Maintain clear documentation and communication across engineering, manufacturing, and quality teams.
  • Support NPI and transition to manufacturing.

Customer Engagement
  • Act as the primary technical interface for customer engagements.
  • Translate customer requirements into actionable design goals and provide support during design reviews, prototyping, and field validation.
  • Present product concepts early in the development cycle and incorporate feedback into design iterations.

Qualifications
  • Bachelor's or Master's degree in Mechanical or Electrical Engineering.
  • 5+ years of experience in connector or high-speed product development.
  • Proficiency in CAD tools (SolidWorks, Creo) and simulation software (ANSYS).
  • Strong understanding of signal integrity, EMI/EMC, and thermal management.
  • Experience with materials and manufacturing processes including stamping, plating, molding, and assembly.
  • Excellent communication skills with global teams and customers.
  • Ability to manage multiple projects and prioritize effectively.

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