Process Engineer

In this critical role, you will be responsible for a broad range of backend wafer fabrication processes within MACOM's internal wafer fab. Key areas of responsibility include dicing, scribe & break, grind/polish, glassing, wafer bonding, and mount/dismount operations. You will also provide support in other process areas as needed and serve as backup coverage for additional operations within the upstairs fab.

This position encompasses both the development of new manufacturing processes and the sustainment and continuous improvement of existing production processes. The product portfolio includes technologies based on GaN, GaAs, Si, and InP platforms, offering opportunities to work across a diverse range of semiconductor products and applications.

Main Duties and Responsibilities
• Develop, sustain, and continuously improve wafer fabrication processes in close collaboration with Device Engineering, Integration Engineering, and Business Unit design teams.
• Serve in a hands-on engineering role requiring a broad understanding of wafer fabrication equipment and processes. Responsibilities include the setup, qualification, optimization, and troubleshooting of automated equipment used for dicing, scribe & break, wafer grinding, edge grinding, chemical-mechanical planarization (CMP), polishing, wafer bonding, glassing and mount/demount operations.
• Drive process performance to meet factory objectives by planning and executing experiments, fully characterizing processes throughout the development cycle, and implementing improvements in quality, reliability, cost, yield, process capability, productivity, and safety. Evaluate and optimize key process variables, including materials, methods, equipment, environment, and operator interactions.
• Provide daily process support, including equipment setup, program creation and maintenance, parameter optimization, engineering lot execution, equipment troubleshooting, and support for production teams in identifying, investigating, and dispositioning nonconforming material.
• Take ownership of assigned process areas from concept through production. Responsibilities include equipment selection, process and equipment qualification, development of operating procedures and work instructions, operator and technician training, and maintenance of routing and manufacturing documentation.
• Apply a strong technical foundation in electronics manufacturing while maintaining expertise in wafer fabrication processes and best practices.

Key Competencies Required
• Demonstrated sound judgment, a solid understanding of semiconductor manufacturing processes, and a proactive, results-oriented approach to problem solving.
• Ability to develop and implement effective solutions using engineering fundamentals, statistical analysis, and structured problem-solving methodologies.
• Proven record of successfully resolving technical challenges, leading projects to completion, meeting deadlines, and managing multiple priorities in a fast-paced manufacturing environment.
• Strong sense of ownership, accountability, and commitment to continuous improvement and operational excellence.
• Ability to collaborate effectively with cross-functional teams, including Operations, Quality, Manufacturing, Device Engineering, Integration Engineering, and Business Units, to drive process and product improvements.
• Excellent verbal and written communication skills, with the ability to prepare technical reports, data-driven analyses, process specifications, equipment documentation, procedures, and work instructions.
• Knowledge of optical component fabrication, polishing, and related manufacturing techniques.
• Working knowledge of backend process, dicing, scribe & break, wafer polishing, wafer grinding, edge grinding, glassing and chemical-mechanical planarization (CMP) processes.
• Hands-on experience with wafer fabrication equipment, process development, qualification, and production support.
• Basic project management skills with the ability to work independently and drive projects with minimal supervision.
• Strong presentation and interpersonal skills, with the ability to effectively communicate technical concepts and project status to all levels of the organization, including senior management.

Minimum Qualifications
• BS in Engineering. Minimum 5 years of relevant work experience in semiconductors / Wafer fabrication process.
• Familiarity with typical material systems used in compound semiconductors and a solid understanding of device physics and IC processing.
• Demonstrated knowledge of compound semiconductor processing in a wafer fabrication environment or similar setting.
• Experience with data mining, statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem-solving methodologies is preferred.
• Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Salary Range

The Salary Range for this position is $98,000 - $130,000. Actual salary offered to candidates will depend on several factors, including but not limited to, work location, relevant candidates' experience, education, and specific knowledge, skills, and abilities.

RSU Eligible

This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOM's discretion, subject to individual and company performance.

Benefits: This position offers a comprehensive benefits package including but not limited to:
• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.