We are looking for a Process Engineer with experience in Semiconductor Packaging, especially in high power applications. The successful candidate will spend approximately 50% performing Process Engineering and 50% of their time leading New Product Introduction (NPI) for high power LED products. This is an excellent opportunity for an experienced Process Engineer to diversify his career with Product Development - Project Management Experience.
Key Responsibilities:50%
- Develop recipes for wire bonding, die attach and dispensing processes for a low volume prototype assembly line.
- Build Control Plan for these processes and track via destructive test monitoring and SPC.
- Publish lot reports, including pareto of yield losses, CpK, etc.
- Transfer recipes, control plan, etc. to high volume manufacturing partners in the Asia region.
- Evaluate new materials for these processes to improve performance or reduce costs.
50%
- Develop high power LED packages for Medical, Life Sciences and Industrial applications. This requires innovative thinking on concepts, conducting optical performance testing and hands on experimentation to validate design.
- Collaborate with Asian Contract Manufacturers to co-develop LED packages from initial concepts through mass production to optimize performance and cost.
- Engage with the Supply Chain for critical Bill of Material items, e.g. prisms, interposers, etc.
- Manage projects and track progress. Update the larger Project team on a weekly basis.
- Generating intellectual property and working with patent attorneys to file patent applications.
Qualifications for the Position: - Master or PhD degree in engineering, physics, materials or related fields.
- Minimum 5 years of experience in manufacturing processing of semiconductor packages, including wire bonding, die attach (epoxy, eutectic, sintering) and dispensing. Experience with high power packages is preferred. Specific experience with LED Diode packages is highly desirable.
- Be familiar with the standard packaging technologies used in power devices, such as lead frame, ceramic (single & multi-layer) and ceramic packages with integrated copper heat spreaders.
- Have experience with hermetic sealing, over molding and transfer/injection molding processes.
- Practice with critical processes such as D/PFMEA for power semiconductor products.
- Experience working with CM's is desirable.
- Highly motivated individual and good team player. "Whatever it takes" attitude - Strong sense of project ownership with strong desire to push projects toward end goals.
- Be able to travel internationally on a need basis. (up to 20%)
Benefits & Perks: - Medical/Dental/Vision Insurance
- Paid Time Off & Holidays
- 401k Retirement Savings Plan w/ Employer Match
- Flexible Spending Accounts
- Employee Assistance Program
- Life/AD&D Insurance
- And more!
Compensation Range: $130,000 - $175,000 / year
Title and compensation will be commensurate with experience and qualification.
