DescriptionWe are seeking a Process Engineer - Printed Circuit Board Manufacturing to be a technical leader in the Printed Circuit Board Fabrication Section, a part of the Advanced Electrical Fabrication Group. This is an outstanding opportunity to apply your passion for electronics fabrication toward sophisticated prototypes and one-of-a kind systems, that advance the scientific knowledge of humankind, safeguard our nation's security, and contribute to the exploration and research in space.
In this role, you will facilitate the fabrication and technology development of printed circuit boards, flex substrates, and rigid flex, used to solve bold problems, whose solutions have an important bearing on national security, military readiness, space exploration, national health, and the advancement of fundamental science or engineering. We work as a tight knit team of professional and technical support staff to fabricate printed circuit boards in a low-volume, high mix environment to meet wide-ranging requirements from quick turn prototypes to space-flight certified electronics.
As a Process Engineer - Printed Circuit Board Manufacturing, you will:- Provide technical direction for the future of printed circuit board fabrication, working closely with the Group's Chief Engineer and the section supervisor to ensure Section's long term vision aligns with the Lab's foreseen Technology Roadmap.
- Identify capital equipment and develop staff to maintain technical excellence.
- Participate in key technical efforts identify emerging opportunities and challenges review and supervise technical tasks and ensure timely completion of product.
- Ensure the highest standards of technical excellence and quality are met on every project.
- Collaborate with equipment suppliers on troubleshooting and maintenance, and engage internal Lab facilities management, engineers, and support to maintain operations.
- Maintain hands-on involvement in fabrication activities as required to develop, troubleshoot, qualify, and improve manufacturing processes.
- Perform fabrication tasks including, but not limited to, mSAP development, various plating processes, lamination, chemical etching, soldermask and silkscreen application, via fill, operation of CNC drilling/routing equipment, and laser via processing.
- Ensure equipment and facilities are maintained in operational working order. Complete maintenance as able.
As a team, we will:- Establish and promote a climate conducive to intellectual curiosity, creativity, innovation, collaboration, growth, productivity, and respect for others.
- Develop and control fabrication schedules and cost estimates.
- Lead and mentor staff. Recruit, develop, and retain a staff with outstanding technical capabilities. Provide professional development mentorship. Ensure assignment of work to staff is consistent with staff development and project needs.
- Communicate often and effectively with staff and customers.
- Support new business activities to expand the scope of the programs within the Research and Exploratory Development Business Area and explore related opportunities in relevant business areas. Support sponsor engagement and concept development. Assist or lead activities to acquire new work for the Group, which may include proposal writing and meetings with the potential sponsors.
Special Working Conditions:- Job involves the use of chemistries and maintenance of equipment which could involve lifting up to 50 pounds.
QualificationsYou meet our minimum qualifications for the job if you...- Hold a Bachelor's Degree in Chemistry, Chemical Engineering, Manufacturing engineering, or similar scientific or engineering discipline or equivalent work experience.
- 3+ years of relevant experience in printed circuit board processing, equipment, chemistries or a closely related discipline.
- Experience with industry specifications for rigid and rigid-flex circuits, IPC 6012, and IPC 6013 standards is required.
- Proven ability to establish relationships and effectively interact with all levels of staff and management, as well as with internal and external customers.
- Ability to effectively lead a team of technical staff in solving complex problems.
- Excellent written and verbal communication skills.
- Demonstrated ability to effectively lead a team of professional and support staff, solving complex problems.
- Are able to obtain Secret level security clearance. If selected, you will be subject to a government security clearance investigation and must meet the requirements for access to classified information. Eligibility requirements include U.S. citizenship.
You 'll go above and beyond our minimum requirements if you...- Hold an Advanced degree in electrical engineering, manufacturing engineering or similar scientific or engineering discipline.
- Possess 10+ years of previous experience in PCB industry, with significant hands-on experience in fabrication.
- Have experience with High Density Interconnect (HDI) fabrication.
- Have experience with facility and equipment specifications review, implementing capital purchase through commissioning and operational verification.
Minimum Rate$85,000 Annually
Maximum Rate$195,000 Annually
