PROCESS ENGINEERKeeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.
RESPONSIBILITIES- Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders
- Design production processes from the lab bench through proof of concept and production ramp
- Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs
- Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution
- Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging
- Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction
- Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles
- Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield
QUALIFICATIONS- B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field
- Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools
- Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
- Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
- Ability to interpret process documentation, equipment specifications, and production data to drive consistent output
- Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
- Willingness to work extended hours and weekends as needed
PREFERRED EXPERIENCE- Direct experience qualifying or operating production equipment in a high-volume production environment
- Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging
- Familiarity with statistical process control and root cause analysis methods
- 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices
COMPENSATION AND BENEFITS:Pay range:
Process Engineer: $90,000.00 - $140,000.00/per year
Title and base salary are determined on a case by case basis commensurate with experience and merit.
In addition to base salary, compensation for this role includes:
- Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
- Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
- Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
- 401(k) retirement plan access.
- Relocation assistance to sunny Los Angeles.
