Microsoft

Principal Subsystem Design Engineer

Microsoft$142K — $274K *
Consumer Technology
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience, OR Master's Degree with 6+ years, OR Bachelor's with 8+ years, OR equivalent.
  • 9+ years experience in RTL design with a focus on high-performance IP, SS or SoC designs.
  • Expertise in microarchitecture specification, RTL coding, and design verification.
  • Experience in synthesis, timing constraints, and PPA trade-offs.
  • Lead experience on IP or SoC related to CPUs, VPUs, GPUs, or DMA engines.
  • Experience leading cross-functional engineering teams across time zones.
  • Experience working on AI/ML SoCs.

Responsibilities

  • Provide technical leadership for Memory Subsystem development, driving solutions from architecture to silicon bring-up.
  • Lead the design, integration, and verification of complex SoC subsystems focusing on memory technology.
  • Collaborate with various teams to troubleshoot system-level issues and ensure robust silicon delivery.
  • Drive component reuse across projects ensuring efficient subsystem architectures.
  • Mentor and lead design reviews to maintain engineering best practices.
  • Develop and optimize subsystem architectures involving PCIe, HBM, and related technologies.
  • Implement design including microarchitecture specification and RTL development using Verilog/SystemVerilog.
  • Debug design and system-level issues across simulation and silicon environments.
  • Champion high-quality engineering execution to deliver cutting-edge IP and SoC solutions.

Benefits

  • Comprehensive health coverage for employees and dependents.
  • Generous retirement plan options and support.
  • Paid time off including holidays and personal days.
  • Opportunities for professional development and training.
  • Access to wellness programs and resources.
Full Job Description
Responsibilities

  • Provide technical leadership for Memory Subsystem development as a Design engineer, driving solutions from architecture and microarchitecture through silicon bring-up.


  • Lead the design, integration, and verification of high-performance, complex SoC subsystems, with a focus on memory technologies, bandwidth, latency, utilization, power, and overall system efficiency.


  • Collaborate closely with Architecture, RTL Design, DV, Physical Design (PD), Design-for-Test (DFT), Firmware, and Post-Silicon teams to resolve system-level issues and deliver robust silicon.


  • Drive vertical and horizontal IP/component reuse across projects and platforms, ensuring scalable and efficient subsystem architectures.


  • Provide technical leadership through mentorship, design reviews, code reviews, and cross-functional collaboration, helping to establish and maintain engineering best practices.


  • Develop and optimize subsystem architectures involving PCIe, HBM, imaging and control subsystems, interconnect fabrics, AMBA AXI/CHI protocols, DMA engines, NoCs, and high-throughput data buffering and movement.


  • Drive design implementation, including microarchitecture specification, RTL development and integration using Verilog/SystemVerilog, synthesis, timing constraints, floor-planning considerations, performance optimization, and design-quality closure including CDC, lint, and RDC.


  • Debug complex design and system-level issues across simulation, emulation, and silicon, working across disciplines to identify root causes and implement effective solutions.


  • Drive execution in an Agile development environment, including sprint planning, feature deployment, code reviews, issue resolution, and continuous improvement of design and verification processes.


  • Champion high-quality engineering execution and contribute to delivering cutting-edge, custom IP and SoC solutions that meet demanding performance, power, efficiency, and schedule requirements.


Qualifications

Required Qualifications:
  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience
  • OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience
  • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience
  • OR equivalent experience.


Preferred Qualifications:

  • 9+ years of experience in RTL design with a proven track record of delivering high-performance IP, SS, or SoC designs such as PCIe, DDR, or HBM.


  • Expertise in microarchitecture specification, RTL coding, and design verification collaboration.


  • Experience in synthesis, timing constraints, power / performance / area (PPA) trade-offs and post-silicon debug.


  • Experience with design quality and static checks, DFT implementation and hand off to physical design.


  • Lead experience for an IP or SS related to CPUs, VPUs, GPUs, Direct Memory Access (DMA) engine, Tensor unit, or similar


  • Experience with lead roles across cross-functional / cross-time-zone engineering teams


  • Experience of working on Artificial Intelligence (AI) / Machine Learning (ML) SoCs


  • Experience in Scripting language such as Python or Perl


Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

About Microsoft

Microsoft is an American multinational corporation that develops, manufactures, licenses, supports, and sells a range of software products and services. Microsoft’s devices and consumer (D&C) licensing segment licenses the Windows operating system and related software, Microsoft Office for consumers, and the Windows Phone operating system. The company’s computing and gaming hardware segment provides Xbox gaming and entertainment consoles and accessories, second-party and third-party video games, and Xbox Live subscriptions; surface devices and accessories; and Microsoft PC accessories. Its phone hardware segment offers Lumia smartphones and other non-Lumia phones. Its D&C segment provides Windows Store, Xbox Live transactions, and Windows phone store; search advertising; display advertising; Office 365 Home and Office 365 Personal; first-party video games; and other consumer products and services as well as operating retail stores. Microsoft’s commercial licensing segments license server products, including Windows Server, Microsoft SQL Server, Visual Studio, System Center, and related Client Access Licenses (CALs); Windows Embedded; Windows operating system; Microsoft Office for business, including Office, Exchange, SharePoint, Lync, and related CALs; Microsoft Dynamics business solutions; and Skype. Its commercial segment offers enterprise services, including premier support services and Microsoft consulting services; commercial cloud comprising Office 365 Commercial, other Microsoft Office online offerings, Dynamics CRM Online, and Microsoft Azure; and other commercial products and online services. The company markets and distributes its products through original equipment manufacturers, distributors, and resellers, as well as online.

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Learn more about Microsoft
Size
181,000 employees
Market Cap
$1,762.4 billion
Industry
Net Income
$51.3 billion
Founded
1975
5 Year Trend
+15.5%
Revenue
$153.2 billion
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